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 PRELIMINARY PRODUCT SPECIFICATION
Z86C34/C35/C36 Z86C44/C45/C46
CMOS Z8(R) MCUS WITH ASCI UART OFFER EFFICIENT, COST-EFFECTIVE DESIGN FLEXIBILITY
FEATURES
Device Z86C34 Z86C35 Z86C36 Z86C44 Z86C45 Z86C46 ROM (KB) 16 32 64 16 32 64 RAM* (Bytes) 237 237 237 236 236 236 Speed (MHz) 16 16 16 16 16 16
* * * * * * * * * * *
Expanded Register File (ERF) Full-Duplex UART (ASCI) Dedicated 16-Bit Baud Rate Generator 32 Input/Output Lines (C44/C45/C46) 24 Input/Output Lines (C34/C35/C36) Vectored, Prioritized Interrupts with Programmable Polarity Two Analog Comparators Two Programmable 8-Bit Counter/Timers, Each with Two 6-Bit Programmable Prescaler Watch-Dog Timer (WDT)/Power-On Reset (POR) On-Chip Oscillator that Accepts a Crystal, Ceramic Resonator, LC, RC, or External Clock RAM and ROM Protect Optional 32-kHz Oscillator
Note: *General-Purpose.
* * * * *
28-Pin DIP, 28-Pin SOIC and PLCC Packages (C34, C35, C36) 40-Pin DIP, 44-Pin PLCC and QFP Packages (C44, C45, C46) 3.0- to 5.5-Volt Operating Range Clock Free Watch-Dog Timer (WDT) Reset Operating Temperature Ranges: Standard: 0 C to 70 C Extended: -40 C to +105 C
GENERAL DESCRIPTION
ZiLOG's Z8(R) MCU single-chip family now includes the Z86C34/C35/C36/C44/C45/C46 product line, featuring enhanced wake-up circuitry, programmable Watch-Dog Timers (WDT), and low-noise/EMI options. Each of the new enhancements to the Z8 offer a more efficient, cost-effective design and provide the user with increased design flexibility over the standard Z8 microcontroller core. The low-power consumption CMOS microcontroller offers fast execution, efficient use of memory, sophisticated interrupts, input/output bit manipulation capabilities, and easy hardware/software system expansion. The Z8 subfamily features an Expanded Register File (ERF) to allow access to register-mapped peripheral and I/O circuits. Four basic address spaces are available to support this wide range of configurations: Program Memory, Register File, Data Memory, and ERF. The Register File is composed of 236/237 bytes of general-purpose registers, four I/O port registers, and 15 control and status registers. The ERF consists of twelve control registers. For applications demanding powerful I/O capabilities, the Z86C34/C35/C36 offers 24 pins, and the Z86C44/C45/C46 offers 32 pins dedicated to input and output. These lines are
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Z86C34/C35/C36/C44/C45/C46 CMOS Z8(R) MCUs with ASCI UART
ZiLOG
GENERAL DESCRIPTION (Continued)
configurable under software control to provide timing, status signals, parallel I/O with or without handshake, and address/data bus for interfacing external memory. To unburden the system from coping with real-time tasks such as counting/timing and data communication, the Z8 offer two on-chip counter/timers with a large number of user-selectable modes. With ROM/ROMless selectivity, the Z86C44/C45/C46 provide both external memory and preprogrammed ROM, which enables this Z8(R) MCU to be used in high-volume applications, or where code flexibility is required.
Note: All signals with an overline are active Low. For example, B/W, for which WORD is active Low, and B/W, for which BYTE is active Low.
Power connections follow these conventional descriptions:
Connection Power Ground Circuit VCC GND Device VDD VSS
(C44/C45/C46 Only) Output Input VCC
GND
XTAL AS DS R/W RESET
Port 3
Machine Timing & Inst. Control RESET WDT, POR
Counter/ Timers (2) Interrupt Control Two Analog Comparators Full-Duplex UART 16-Bit Baud Rate Generator
ALU
FLAG Program Memory Register Pointer Register File Program Counter
Port 2
Port 0
Port 1
4 I/O (Bit Programmable)
4
8
Address or I/O (Nibble Programmable)
Address/Data or I/O (Byte Programmable) (C44/C45/C46 Only)
Figure 1. Functional Block Diagram 2 PRELIMINARY DS007601-Z8X0499
ZiLOG
Z86C34/C35/C36/C44/C45/C46 CMOS Z8(R) MCUs with ASCI UART
PIN DESCRIPTION
P25 P26 P27 P04 P05 P06 P07 VCC XTAL2 XTAL1 P31 P32 P33 P34 1 P24 P23 P22 P21 P20 P03 GND P02 P01 P00 P30 P36 P37 P35
P04 P27 P26 P25 P24 P23 P22 4 P05 P06 P07 VCC XTAL2 XTAL1 P31 5 1 26 25
28
Z86C34/C35/C36
Z86C34/C35/C36
11 12
19 18
P21 P20 P03 GND P02 P01 P00
14
15
Figure 2. 28-Pin DIP/SOIC Pin Configuration
Figure 3. 28-Pin PLCC Pin Configuration
Table 1. 28-Pin DIP/SOIC/PLCC Pin Identification Pin # 1-3 4-7 8 9 10 11-13 14-15 16 17 18 19-21 22 23 24-28 Symbol P25-27 P04-07 VCC XTAL2 XTAL1 P31-33 P34-35 P37 P36 P30 P00-02 GND P03 P20-24 Function Port 2, Bits 5,6,7 Port 0, Bits 4,5,6,7 Power Supply Crystal Oscillator Crystal Oscillator Port 3, Bits 1,2,3 Port 3, Bits 4,5 Port 3, Bit 7 Port 3, Bit 6 Port 3, Bit 0 Port 0, Bits 0,1,2 Ground Port 0, Bit 3 Port 2, Bits 0,1,2,3,4 Direction In/Output In/Output Output Input Fixed Input Fixed Output Fixed Output Fixed Output Fixed Input In/Output In/Output In/Output
DS007601-Z8X0499
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P32 P33 P34 P35 P37 P36 P30
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Z86C34/C35/C36/C44/C45/C46 CMOS Z8(R) MCUs with ASCI UART
ZiLOG
PIN DESCRIPTION (Continued)
R/W P25 P26 P27 P04 P05 P06 P14 P15 P07 VCC P16 P17 XTAL2 XTAL1 P31 P32 P33 P34 AS
1
40
Z86C44/C45/C46
20
21
DS P24 P23 P22 P21 P20 P03 P13 P12 GND P02 P11 P10 P01 P00 P30 P36 P37 P35 RESET
Figure 4. 40-Pin DIP Configuration
Table 2. 40-Pin Dual-In-Line Package Pin Identification Pin # 1 2-4 5-7 8-9 10 11 12-13 14 15 16-18 19 20 Symbol R/W P25-27 P04-06 P14-15 P07 VCC P16-17 XTAL2 XTAL1 P31-33 P34 AS Function READ/WRITE Port 2, Bits 5,6,7 Port 0, Bits 4,5,6 Port 1, Bits 4,5 Port 0, Bit 7 Power Supply Port 1, Bits 6,7 Crystal Oscillator Crystal Oscillator Port 3, Bits 1,2,3 Port 3, Bit 4 Address Strobe Direction Output In/Output In/Output In/Output In/Output In/Output Output Input Input Output Output
Table 2. 40-Pin Dual-In-Line Package Pin Identification Pin # 21 22 23 24 25 26-27 28-29 30 31 32-33 34 35-39 40 Symbol RESET P35 P37 P36 P30 P00-01 P10-11 P02 GND P12-13 P03 P20-24 DS Function Reset Port 3, Bit 5 Port 3, Bit 7 Port 3, Bit 6 Port 3, Bit 0 Port 0, Bit 0,1 Port 1, Bit 0,1 Port 0, Bit 2 Ground Port 1, Bit 2,3 Port 0, Bit 3 Port 2, Bit 0,1,2,3,4 Data Strobe Direction Input Output Output Output Input In/Output In/Output In/Output In/Output In/Output In/Output Output
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Z86C34/C35/C36/C44/C45/C46 CMOS Z8(R) MCUs with ASCI UART
P21 P22 P23 P24 DS NC R/W P25 P26 P27 P04
7
P20 P03 P13 P12 GND GND P02 P11 P10 P01 P00 6 1 40 39
Z86C44/C45/C46
17
18
29 28
P30 P36 P37 P35 RESET R/RL AS P34 P33 P32 P31
Figure 5. 44-Pin PLCC Pin Configuration
Table 3. 44-Pin PLCC Pin Identification Pin # 1-2 3-4 5 6-10 11 12 13 14-16 17-19 20-21 22 23-24 25-26 Symbol GND P12-13 P03 P20-24 DS NC R/W P25-27 P04-06 P14-15 P07 VCC P16-17 Function Ground Port 1, Bits 2,3 Port 0, Bit 3 Port 2, Bits 0,1,2,3,4 Data Strobe Not Connected READ/WRITE Port 2, Bits 5,6,7 Port 0, Bits 4,5,6 Port 1, Bits 4,5 Port 0, Bit 7 Power Supply Port 1, Bits 6,7 Direction In/Output In/Output In/Output Output Output In/Output In/Output In/Output In/Output In/Output Pin # 27 28 29-31 32 33 34 35 36 37 38 39 40-41 42-43 44
P05 P06 P14 P15 P07 VCC VCC P16 P17 XTAL2 XTAL1
Table 3. 44-Pin PLCC Pin Identification Symbol XTAL2 XTAL1 P31-33 P34 AS R/RL RESET P35 P37 P36 P30 P00-01 P10-11 P02 Function Crystal Oscillator Crystal Oscillator Port 3, Bits 1,2,3 Port 3, Bit 4 Address Strobe ROM/ROMless Control Reset Port 3, Bit 5 Port 3, Bit 7 Port 3, Bit 6 Port 3, Bit 0 Port 0, Bits 0,1 Port 1, Bits 0,1 Port 0, Bit 2 Direction Output Input Input Output Output Input Input Output Output Output Input In/Output In/Output In/Output
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Z86C34/C35/C36/C44/C45/C46 CMOS Z8(R) MCUs with ASCI UART
ZiLOG
PIN DESCRIPTION (Continued)
P21 P22 P23 P24 DS NC R/W P25 P26 P27 P04
33 34
P20 P03 P13 P12 GND GND P02 P11 P10 P01 P00 23 22
Z86C44/C45/C46
44 1
12 11
P30 P36 P37 P35 RESET R/RL AS P34 P33 P32 P31
Figure 6. 44-Pin QFP Pin Configuration
Table 4. 44-Pin QFP Pin Identification Pin # 1-2 3-4 5 6-7 8-9 10 11 12-14 15 16 17 18 19 20 Symbol P05-06 P14-15 P07 VCC P16-17 XTAL2 XTAL1 P31-33 P34 AS R/RL RESET P35 P37 Function Port 0, Bits 5,6 Port 1, Bits 4,5 Port 0, Bit 7 Power Supply Port 1 Bits 6,7 Crystal Oscillator Crystal Oscillator Port 3, Bits 1,2,3 Port 3, Bit 4 Address Strobe ROM/ROMless Control Reset Port 3, Bit 5 Port 3, Bit 7 Direction In/Output In/Output In/Output In/Output Output Input Input Output Output Input Input Output Output Pin # 21 22 23-24 25-26 27 28-29 30-31 32 33-37 38 39 40
P05 P06 P14 P15 P07 VCC VCC P16 P17 XTAL2 XTAL1
Table 4. 44-Pin QFP Pin Identification Symbol P36 P30 P00-01 P10-11 P02 GND P12-13 P03 P20-24 DS NC R/W Function Port 3, Bit 6 Port 3, Bit 0 Port 0, Bits 0,1 Port 1, Bits 0,1 Port 0, Bit 2 Ground Port 1, Bits 2,3 Port 0, Bit 3 Port 2, Bits 0,1,2,3,4 Data Strobe Not Connected READ/WRITE Direction Output Input In/Output In/Output In/Output In/Output In/Output In/Output Output Output
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DS007601-Z8X0499
ZiLOG
Z86C34/C35/C36/C44/C45/C46 CMOS Z8(R) MCUs with ASCI UART
ABSOLUTE MAXIMUM RATINGS
Parameter Ambient Temperature under Bias Storage Temperature Voltage on any Pin with Respect to VSS Voltage on VDD Pin with Respect to VSS Voltage on XTAL1 and RESET Pins with Respect to VSS Total Power Dissipation Maximum Allowable Current out of VSS Maximum Allowable Current into VDD Maximum Allowable Current into an Input Pin Maximum Allowable Current into an Open-Drain Pin Maximum Allowable Output Current Sunk by Any I/O Pin Maximum Allowable Output Current Sourced by Any I/O Pin -600 -600 Min -40 -65 -0.6 -0.3 -0.6 Max +105 +150 +7 +7 VDD+1 1.21 220 180 +600 +600 25 25 Units C C V V V W mA mA A A mA mA 3 4 2 Notes
1
Notes: 1. Applies to all pins except XTAL pins and where otherwise noted. 2. There is no input protection diode from pin to VDD and current into pin is limited to 600 A. 3. Excludes XTAL pins. 4. Device pin is not at an output Low state.
Stresses greater than those listed under Absolute Maximum Ratings may cause permanent damage to the device. This rating is a stress rating only. Functional operation of the device at any condition above those indicated in the operational sections of these specifications is not implied. Exposure to absolute maximum rating conditions for an extended period may affect device reliability.
Total power dissipation should not exceed 1.21 W for the package. Power dissipation is calculated as follows:
Total Power Dissipation = VDD x [IDD - (sum of IOH), + sum of [(VDD - VOH) x IOH] + sum of (VOL x IOL)
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Z86C34/C35/C36/C44/C45/C46 CMOS Z8(R) MCUs with ASCI UART
ZiLOG
STANDARD TEST CONDITIONS
The characteristics listed in following pages apply for standard test conditions as noted. All voltages are referenced to GND. Positive current flows into the referenced pin (see Figure 7.)
From Output Under Test
150 pF
Figure 7. Test Load Diagram
CAPACITANCE TA = 25C, VCC = GND = 0V, f = 1.0 MHz, unmeasured pins to GND
Parameter Input capacitance Output capacitance I/O capacitance Min 0 0 0 Max 12 pF 12 pF 12 pF
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Z86C34/C35/C36/C44/C45/C46 CMOS Z8(R) MCUs with ASCI UART
DC ELECTRICAL CHARACTERISTICS
Table 5. DC Characteristics TA = 0C to +70C Sym VCH Parameter Clock Input High Voltage VCC
1
TA = -40C to +105C Min 0.7 VCC Max VCC+0.3 Typical2 @25C 1.8 Units Conditions V Driven by External Clock Generator Driven by External Clock Generator Driven by External Clock Generator Driven by External Clock Generator Notes
Min 0.7 VCC
Max VCC+0.3
3.0V
5.5V
0.7 VCC
VCC+0.3
0.7 VCC
VCC+0.3
2.6
V
VCL
Clock Input Low Voltage
3.0V
GND-0.3
0.2 VCC
GND-0.3
0.2 VCC
1.2
V
5.5V
GND-0.3
0.2 VCC
GND-0.3
0.2 VCC
2.1
V
VIH VIL VOH
Input High Voltage Input Low Voltage Output High Voltage (Low-EMI Mode) Output High Voltage Output Low Voltage (Low-EMI Mode) Output Low Voltage
3.0V 5.5V 3.0V 5.5V 3.0V 5.0V
0.7 VCC 0.7 VCC GND-0.3 GND-0.3 VCC-0.4 VCC-0.4
VCC+0.3 VCC+0.3 0.2 VCC 0.2 VCC
0.7 VCC 0.7 VCC GND-0.3 GND-0.3 VCC-0.4 VCC-0.4
VCC+0.3 VCC+0.3 0.2 VCC 0.2 VCC
1.8 2.6 1.1 1.6 3.1 4.8
V V V V V V IOH = -0.5 mA IOH = -0.5 mA
VOH1
3.0V 5.5V 3.0V 5.0V 3.0V 5.5V
VCC-0.4 VCC-0.4 0.6 0.4 0.6 0.4
VCC-0.4 VCC-0.4 0.6 0.4 0.6 0.4
3.1 4.8 0.2 0.1 0.2 0.1
V V V V V V
IOH = -2.0 mA IOH = -2.0 mA IOL = 1.0 mA IOL = 1.0 mA IOL = +4.0 mA IOL = +4.0 mA
3 3
VOL
VOL1
3 3
Notes: 1. The VCC voltage specification of 3.0V guarantees 3.3V 0.3V with typicals at VCC = 3.3V, and the VCC voltage specification of 5.5V guarantees 5.0V 0.5V with typicals at VCC = 5.0V. 2. Typicals are at VCC = 5.0V and 3.3V. 3. Standard Mode (not Low EMI). 4. Not applicable to devices in 28-pin packages. 5. For analog comparator, inputs when analog comparators are enabled. 6. All outputs unloaded, I/O pins floating, inputs at rail. 7. Same as note 6, except inputs at VCC. 8. Clock must be forced Low, when XTAL 1 is clock-driven and XTAL2 is floating. 9. 0C to 70C (standard temperature). 10. Auto Latch (Mask Option) selected. 11. The VLV voltage increases as the temperature decreases and overlaps lower VCC operating region. 12. -40C to 150C (extended temperature).
DS007601-Z8X0499
PRELIMINARY
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Z86C34/C35/C36/C44/C45/C46 CMOS Z8(R) MCUs with ASCI UART
ZiLOG
DC ELECTRICAL CHARACTERISTICS (Continued)
Table 5. DC Characteristics (Continued) TA = 0C to +70C Sym VOL2 VRH Parameter Output Low Voltage Reset Input High Voltage Reset Input Low Voltage Reset Output Low Voltage Comparator Input Offset Voltage Input Leakage Output Leakage Reset Input Current Supply Current VCC
1
TA = -40C to +105C Min Max 1.2 1.2 .8 VCC .8 VCC GND-0.3 GND-0.3 VCC VCC 0.2 VCC 0.2 VCC 0.6 0.6 25 25 -1 -1 -1 -1 -18 -18 2 2 2 2 -130 -180 20 25 15 20 Typical2 @25C 0.3 0.4 1.8 2.6 1.1 1.6 0.3 0.3 10 10 0.004 0.004 0.004 0.004 -60 -85 7 20 5 15 Units Conditions V V V V V V V V mV mV A A A A A A mA mA mA mA VIN = 0V, VCC VIN = 0V, VCC VIN = 0V, VCC VIN = 0V, VCC IOL = +1.0 mA IOL = +1.0 mA IOL = +6 mA IOL = +12 mA Notes 3 3 4 4 4 4 4 4 5 5
Min
Max 1.2 1.2
3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V -1 -1 -1 -1 -20 -20 .8 VCC .8 VCC GND-0.3 GND-0.3
VCC VCC 0.2 VCC 0.2 VCC 0.6 0.6 25 25 2 2 1 1 -130 -180 20 25 15 20
VRl
VOLR
VOFFSET
IIL IOL
IIR
ICC
@ 16 MHz @ 16 MHz @ 12 MHz @ 12 MHz
6 6 6 6
Notes: 1. The VCC voltage specification of 3.0V guarantees 3.3V 0.3V with typicals at VCC = 3.3V, and the VCC voltage specification of 5.5V guarantees 5.0V 0.5V with typicals at VCC = 5.0V. 2. Typicals are at VCC = 5.0V and 3.3V. 3. Standard Mode (not Low EMI). 4. Not applicable to devices in 28-pin packages. 5. For analog comparator, inputs when analog comparators are enabled. 6. All outputs unloaded, I/O pins floating, inputs at rail. 7. Same as note 6, except inputs at VCC. 8. Clock must be forced Low, when XTAL 1 is clock-driven and XTAL2 is floating. 9. 0C to 70C (standard temperature). 10. Auto Latch (Mask Option) selected. 11. The VLV voltage increases as the temperature decreases and overlaps lower VCC operating region. 12. -40C to 150C (extended temperature).
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ZiLOG Table 5. DC Characteristics (Continued) TA = 0C to +70C Sym ICC1 Parameter Standby Current (HALT Mode) VCC1 3.0V 5.5V 3.0V Min Max 4.5 8 3.4 TA = -40C to +105C Min Max 4.5 8 3.4
Z86C34/C35/C36/C44/C45/C46 CMOS Z8(R) MCUs with ASCI UART
Typical2 @25C 2.0 3.7 1.5
Units Conditions mA VIN = 0V, VCC @ 16 MHz mA VIN = 0V, VCC @ 16 MHz mA Clock Divideby-16 @ 16 MHz mA Clock Divideby-16 @ 16 MHz A VIN = 0V, VCC WDT is not Running A VIN = 0V, VCC WDT is not Running A VIN = 0V, VCC WDT is Running A VIN = 0V, VCC WDT is Running V V
Notes 6 6 6
5.5V
7.0
7.0
2.9
6
ICC2
Standby Current (STOP Mode)
3.0V
8
8
2
7,8
5.5V
10
10
4
7,8
3.0V
500
600
310
7,8,9
5.5V
800
1000
600
7,8,9
VICR
IALL
Input Common Mode Voltage Range Auto Latch Low Current Auto Latch High Current
3.0V 5.5V
0 0
VCC-1.0V VCC-1.0V
0 0
VCC-1.5V VCC-1.5V
5 5
3.0V 5.5V 3.0V 5.5V
0.7 1.4 -0.6 -1.0
8 15 -5 -8
0.7 1.4 -0.6 -1.0
10 20 -7 -10
3 5 -3 -6
A A A A
0V < VIN < VCC 0V < VIN < VCC 0V < VIN < VCC 0V < VIN < VCC
10 10 10 10
IALH
Notes: 1. The VCC voltage specification of 3.0V guarantees 3.3V 0.3V with typicals at VCC = 3.3V, and the VCC voltage specification of 5.5V guarantees 5.0V 0.5V with typicals at VCC = 5.0V. 2. Typicals are at VCC = 5.0V and 3.3V. 3. Standard Mode (not Low EMI). 4. Not applicable to devices in 28-pin packages. 5. For analog comparator, inputs when analog comparators are enabled. 6. All outputs unloaded, I/O pins floating, inputs at rail. 7. Same as note 6, except inputs at VCC. 8. Clock must be forced Low, when XTAL 1 is clock-driven and XTAL2 is floating. 9. 0C to 70C (standard temperature). 10. Auto Latch (Mask Option) selected. 11. The VLV voltage increases as the temperature decreases and overlaps lower VCC operating region. 12. -40C to 150C (extended temperature).
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Z86C34/C35/C36/C44/C45/C46 CMOS Z8(R) MCUs with ASCI UART
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DC ELECTRICAL CHARACTERISTICS (Continued)
Table 5. DC Characteristics (Continued) TA = 0C to +70C Sym VLV Parameter VCC Low Voltage Protection Voltage VCC
1
TA = -40C to +105C Min 2.0 Max 3.3 Typical2 @25C 2.8 2.8 Units Conditions V 4 MHz max Int. CLK Freq. 6 MHz max Int. CLK Freq. Notes 11,12 9,11
Min
Max
2.2
3.1
Notes: 1. The VCC voltage specification of 3.0V guarantees 3.3V 0.3V with typicals at VCC = 3.3V, and the VCC voltage specification of 5.5V guarantees 5.0V 0.5V with typicals at VCC = 5.0V. 2. Typicals are at VCC = 5.0V and 3.3V. 3. Standard Mode (not Low EMI). 4. Not applicable to devices in 28-pin packages. 5. For analog comparator, inputs when analog comparators are enabled. 6. All outputs unloaded, I/O pins floating, inputs at rail. 7. Same as note 6, except inputs at VCC. 8. Clock must be forced Low, when XTAL 1 is clock-driven and XTAL2 is floating. 9. 0C to 70C (standard temperature). 10. Auto Latch (Mask Option) selected. 11. The VLV voltage increases as the temperature decreases and overlaps lower VCC operating region. 12. -40C to 150C (extended temperature).
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Z86C34/C35/C36/C44/C45/C46 CMOS Z8(R) MCUs with ASCI UART
AC ELECTRICAL CHARACTERISTICS External I/O or Memory READ and WRITE Timing
R/W
13 12 19
Port 0, DM
16 18 3
20
Port 1
A7-A0
1 2
D7-D0 IN
9
AS
8 4 5 6 11
DS (Read)
17
10
Port1
A7-A0
14
D7-D0 OUT
15 7
DS (Write)
Figure 8. External I/O or Memory READ and WRITE Timing
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Z86C34/C35/C36/C44/C45/C46 CMOS Z8(R) MCUs with ASCI UART
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AC ELECTRICAL CHARACTERISTICS (Continued)
Table 6. External I/O or Memory READ and WRITE Timing (C44/C45/C46 Only) (SCLK/TCLK = XTAL/2) TA = -0C to 70C 12 MHz No 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Symbol TdA(AS) TdAS(A) TdAS(DR) TwAS TdAS(DS) TwDSR TwDSW TdDSR(DR) ThDR(DS) TdDS(A) TdDS(AS) TdR/W(AS) TdDS(R/W) Parameter Address Valid to AS Rise Delay AS Rise to Address Float Delay AS Rise to Read Data Req'd Valid AS Low Width Address Float to DS Fall DS (Read) Low Width DS (WRITE) Low Width DS Fall to Read Data Req'd Valid Read Data to DS Rise Hold Time DS Rise to Address Active Delay DS Rise to AS Fall Delay R/W Valid to AS Rise Delay DS Rise to R/W Not Valid VCC
1
TA = -40C to +105C 12 MHz Min 35 35 45 45 Max 16 MHz Min 25 25 35 35 250 250 55 55 0 0 200 200 110 110 40 40 0 0 135 135 80 80 150 150 0 0 45 55 30 45 45 45 45 45 55 55 45 45 0 0 50 50 35 55 25 25 35 35 25 25 35 35 310 310 230 230 75 75 180 180 Max Units Notes ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns 2 2 2 2 2,3 2 2 2
16 MHz Min 25 25 35 35 Max
Min 35 35 45 45
Max
15 16
TdDW(DSW) WRITE Data Valid to DS Fall (WRITE) Delay TdDS(DW) DS Rise to WRITE Data Not Valid Delay TdA(DR) Address Valid to Read Data Req'd Valid
3.0 5.5 3.0 5.5 3.0 5.5 3.0 5.5 3.0 5.5 3.0 5.5 3.0 5.5 3.0 5.5 3.0 5.5 3.0 5.5 3.0 5.5 3.0 5.5 3.0 5.5 3.0 5.5 3.0 5.5 3.0 5.5
250 250 55 55 0 0 200 200 110 110 150 150 0 0 45 55 30 45 45 45 45 45 55 55 45 45 310 310 0 0 50 50 35 35 25 25 35 35 25 25 35 35 40 40 0 0 135 135 80 80
180 180
75 75
2,3 2,3 2,3 2,3 2,3 2,3 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2,3 2,3
230 230
Notes: 1. The VCC voltage specification of 3.0V guarantees 3.3V 0.3V, and the VCC voltage specification of 5.5V guarantees 5.0V 0.5V. 2. Timing numbers provided are for minimum TpC. 3. When using extended memory timing add 2 TpC.
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DS007601-Z8X0499
ZiLOG
Z86C34/C35/C36/C44/C45/C46 CMOS Z8(R) MCUs with ASCI UART Table 6. External I/O or Memory READ and WRITE Timing (C44/C45/C46 Only) (SCLK/TCLK = XTAL/2) (Continued) TA = -0C to 70C 12 MHz 16 MHz Min 45 45 30 30 35 35 35 35 Max VCC1 Min 3.0 5.5 3.0 5.5 3.0 5.5 3.0 5.5 65 65 35 35 45 45 45 45 TA = -40C to +105C 12 MHz Min 65 65 35 35 45 45 45 45 Max 16 MHz Min 45 45 30 30 35 35 35 35 Max Units Notes ns ns ns ns ns ns ns ns 2 2 2 2 2 2 2 2
No 17 18 19 20
Symbol TdAS(DS) TdDM(AS) TdDs(DM) ThDS(AS)
Parameter AS Rise to DS Fall Delay DM Valid to AS Fall Delay DS Rise to DM Valid Delay DS Valid to Address Valid Hold Time
Max
Notes: 1. The VCC voltage specification of 3.0V guarantees 3.3V 0.3V, and the VCC voltage specification of 5.5V guarantees 5.0V 0.5V. 2. Timing numbers provided are for minimum TpC. 3. When using extended memory timing add 2 TpC.
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Z86C34/C35/C36/C44/C45/C46 CMOS Z8(R) MCUs with ASCI UART
ZiLOG
AC ELECTRICAL CHARACTERISTICS (Continued) Additional Timing Diagram
1
3
Clock
2 7 7 2 3
TIN
4 6 5
IRQN
8 9
Clock Setup
11
Stop Mode Recovery Source
10
Figure 9. Additional Timing
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DS007601-Z8X0499
ZiLOG
Z86C34/C35/C36/C44/C45/C46 CMOS Z8(R) MCUs with ASCI UART Table 7. Additional Timing (SCLK/TCLK = XTAL/2) TA = 0C to +70C 12 MHz 16 MHz Min 62.5 62.5 250 250 Max DC DC DC DC 15 15 TA = -40C to +105C 12 MHz Min 83 83 250 250 Max DC DC DC DC 15 15 16 MHz Min 62.5 62.5 250 250 Max Units Notes D1,D0 DC DC DC DC 15 15 ns ns ns ns ns ns ns ns ns ns ns ns 2,3,4 2,3,4 2,3 2,3 2,3 2,3 2,3,4 2,3,4 2,3 2,3 2,3 2,3 2,3 2,3 2,3 2,3 2,3 2,3 2,3,5 2,3,5 2,3,6 2,3,6 2,3,5 2,3,5 7 7 7,8 7,8
No Symbol 1 TpC
Parameter Input Clock Period
2
TrC,TfC
3
TwC
Clock Input Rise & Fall Times Input Clock Width
VCC 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V
1
Min 83 83 250 250
Max DC DC DC DC 15 15
4 5 6 7
TwTinL TwTinH TpTin TrTin, TfTin
Timer Input Low Width Timer Input High Width Timer Input Period Timer Input Rise & Fall Timer Int. Request Low Time Int. Request Low Time Int. Request Input High Time Stop-Mode Recovery Width Spec Oscillator Startup Time
3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V
41 41 125 125 100 70 5TpC 5TpC 8TpC 8TpC 100 100 100 70 5TpC 5TpC 5TpC 5TpC 12 12 5TpC 5TpC
31 31 125 125 100 70 5TpC 5TpC 8TpC 8TpC 100 100 100 70 5TpC 5TpC 5TpC 5TpC 12 12 5TpC 5TpC
41 41 125 125 100 70 5TpC 5TpC 8TpC 8TpC 100 100 100 70 5TpC 5TpC 5TpC 5TpC 12 12 5TpC 5TpC
31 31 125 125 100 70 5TpC 5TpC 8TpC 8TpC 100 100 100 70 5TpC 5TpC 5TpC 5TpC 12 12 5TpC 5TpC
ns ns ns ns
8A TwIL 8B TwIL 9 TwIH
10 Twsm
ns ns
11 Tost
Notes: 1. The VCC voltage specification of 3.0V guarantees 3.3V 0.3V, and the VCC voltage specification of 5.5V guarantees 5.0V 0.5V. 2. Timing Reference uses 0.7 VCC for a logic 1 and 0.2 VCC for a logic 0. 3. SMR D1 = 0. 4. Maximum frequency for external XTAL clock is 4 MHz when using low-EMI Oscillator mode PCON Reg.D7 = 0. 5. Interrupt request via Port 3 (P31-P33). 6. Interrupt request via Port 3 (P30). 7. SMR-D5 = 1, POR STOP Mode Delay is on. 8. For RC and LC oscillator, and for oscillator driven by clock driver. 9. Register WDTMR.
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Z86C34/C35/C36/C44/C45/C46 CMOS Z8(R) MCUs with ASCI UART
ZiLOG
AC ELECTRICAL CHARACTERISTICS (Continued)
Table 7. Additional Timing (SCLK/TCLK = XTAL/2) (Continued) TA = 0C to +70C 12 MHz No Symbol 12 Twdt Parameter Watch-Dog Timer Delay Timer before time-out VCC 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V
1
TA = -40C to +105C 12 MHz Min 7 3.5 14 7 28 14 112 56 3 1 Max 16 MHz Min 7 3.5 14 7 28 14 112 56 3 1 Max Units Notes D1,D0 ms ms ms ms ms ms ms ms ms ms 9 9 9 9 9 9 9 9 0,0 0,0 0,1 0,1 1,0 1,0 1,1 1,1
16 MHz Min 7 3.5 14 7 28 14 112 56 3 1.5 Max
Min 7 3.5 14 7 28 14 112 56 3 1.5
Max
13 TPOR
Power-On Reset Delay
24 13
24 13
25 14
25 14
Notes: 1. The VCC voltage specification of 3.0V guarantees 3.3V 0.3V, and the VCC voltage specification of 5.5V guarantees 5.0V 0.5V. 2. Timing Reference uses 0.7 VCC for a logic 1 and 0.2 VCC for a logic 0. 3. SMR D1 = 0. 4. Maximum frequency for external XTAL clock is 4 MHz when using low-EMI Oscillator mode PCON Reg.D7 = 0. 5. Interrupt request via Port 3 (P31-P33). 6. Interrupt request via Port 3 (P30). 7. SMR-D5 = 1, POR STOP Mode Delay is on. 8. For RC and LC oscillator, and for oscillator driven by clock driver. 9. Register WDTMR.
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ZiLOG
Z86C34/C35/C36/C44/C45/C46 CMOS Z8(R) MCUs with ASCI UART Table 8. Additional Timing (Divide-By-One Mode, SCLK/TCLK = XTAL) TA = 0C to +70C VCC1 8 MHz Min Max 250 250 125 125 DC DC DC DC 25 25 TA = 40C to +105C 8 MHz Min Max 250 250 125 125 DC DC DC DC 25 25
No 1
Symbol Parameter TpC Input Clock Period 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V
Units ns ns ns ns ns ns ns ns ns ns ns ns
Notes 2,3,4 2,3,4 2,3 2,3 2,3 2,3 2,3,4 2,3,4 2,3 2,3 2,3 2,3 2,3 2,3 2,3 2,3 2,3 2,3 2,3,5 2,3,5 2,3,6 2,3,6 2,3,5 2,3,5 7 7 7,8 7,8
2 3
TrC,TfC TwC
Clock Input Rise & Fall Times Input Clock Width
4 5 6 7 8A 8B 9 10 11
TwTinL TwTinH TpTin TrTin, TfTin TwIL TwIL TwIH Twsm Tost
Timer Input Low Width Timer Input High Width Timer Input Period Timer Input Rise & Fall Timer Int. Request Low Time Int. Request Low Time Int. Request Input High Time Stop-Mode Recovery Width Spec Oscillator Startup Time
125 125 62 62 100 70 3TpC 3TpC 4TpC 4TpC 100 100 100 70 3TpC 3TpC 3TpC 3TpC 12 12 5TpC 5TpC
125 125 62 62 100 70 3TpC 3TpC 4TpC 4TpC 100 100 100 70 3TpC 3TpC 3TpC 2TpC 12 12 5TpC 5TpC
ns ns ns ns
ns ns
Notes: 1. The VCC voltage specification of 3.0V guarantees 3.3V 0.3V, and the VCC voltage specification of 5.5V guarantees 5.0V 0.5V. 2. Timing Reference uses 0.7 VCC for a logic "1" and 0.2 VCC for a logic "0". 3. SMR D1 = 0. 4. Maximum frequency for external XTAL clock is 4 MHz when using low-EMI Oscillator mode PCON Reg.D7 = 0. 5. Interrupt request via Port 3 (P31-P33). 6. Interrupt request via Port 3 (P30). 7. SMR-D5 = 1, POR STOP Mode Delay is on. 8. For RC and LC oscillator, and for oscillator driven by clock driver.
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Z86C34/C35/C36/C44/C45/C46 CMOS Z8(R) MCUs with ASCI UART
ZiLOG
AC ELECTRICAL CHARACTERISTICS (Continued) Handshake Timing Diagrams
Data In
Data In Valid
2 3
Next Data In Valid
1
DAV (Input)
4
Delayed DAV
5
6
RDY (Output)
Delayed RDY
Figure 10. Input Handshake Timing
Data Out
Data Out Valid
Next Data Out Valid
7
DAV (Output)
8 9 10
Delayed DAV
11
RDY (Input)
Delayed
RDY
Figure 11. Output Handshake Timing
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DS007601-Z8X0499
ZiLOG Table 9. Handshake Timing1 TA = 0C to +70C 12 MHz No Symbol 1 2 3 4 5 6 7 8 9 10 11 TsDI(DAV) ThDI(RDY) TwDAV TdDAVI(RDY) Parameter Data In Setup Time Data In Hold Time Data Available Width DAV Fall to RDY Fall Delay VCC
2
Z86C34/C35/C36/C44/C45/C46 CMOS Z8(R) MCUs with ASCI UART
TA = -40C to +105C 12 MHz 16 MHz Data Direction IN IN IN IN IN IN IN IN IN IN IN IN OUT OUT OUT OUT OUT OUT OUT OUT OUT OUT
16 MHz
Min Max Min Max Min Max Min Max 0 0 0 0 155 110 0 0 120 80 0 0 42 42 0 0 160 115 110 80 110 80 110 80 110 80 0 0 31 31 0 0 160 115 110 80 110 80 0 0 0 0 155 110 0 0 120 80 0 0 42 42 0 0 160 115 110 80 110 80 0 0 0 0 155 110 0 0 120 80 0 0 31 31 0 0 160 115 0 0 0 0 155 110 0 0 120 80
TdDAVId(RDY) DAV Out to DAV Fall Delay RDY0d(DAV) TdD0(DAV) TdDAV0(RDY) TdRDY0(DAV) TwRDY RDY Rise to DAV Fall Delay Data Out to DAV Fall Delay DAV Fall to RDY Fall Delay RDY Fall to DAV Rise Delay RDY Width
TdRDY0d(DAV) RDY Rise to DAV Fall Delay
3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V
Note:
1. Timing Reference uses 0.7 VCC for a logic 1 and 0.2 VCC for a logic 0. 2. The VCC voltage specification of 3.0V guarantees 3.3V 0.3V. The VCC voltage specification of 5.5V guarantees 5.0V 0.5V.
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Z86C34/C35/C36/C44/C45/C46 CMOS Z8(R) MCUs with ASCI UART
ZiLOG
PIN FUNCTIONS
R/RL (input, active Low). The ROM/ROMless pin, when connected to GND, disables the internal ROM and forces AS (output, active Low). Address Strobe is pulsed one time at the beginning of each machine cycle for external memory transfer. Address output is from Port 0/Port 1 for all external programs. Memory address transfers are valid at the trailing edge of AS. Under program control, AS is placed in the high-impedance state along with Ports 0 and 1, Data Strobe, and READ/WRITE. (Not available for devices in the 28-pin package.) XTAL1 Crystal 1 (time-based input). This pin connects a parallel-resonant crystal, ceramic resonator, LC, or RC net-
the device to function as a ROMless Z8. (Not available for devices in the 28-pin package.)
Notes: When left unconnected or pulled High to VCC, the device functions normally as a Z8 ROM version. When using in ROM Mode in a high-EMI (noisy) environment, the ROMless pins should be connected directly to VCC. DS (output, active Low). Data Strobe is activated one time for each external memory transfer. For a READ operation, data must be available prior to the trailing edge of DS. For WRITE operations, the falling edge of DS indicates that output data is valid. (Not available for devices in the 28pin package.)
work, or an external single-phase clock to the on-chip oscillator input.
XTAL2 Crystal 2 (time-based output). This pin connects a parallel-resonant crystal, ceramic resonant, LC, or RC network to the on-chip oscillator output. R/W (output, WRITE Low). The READ/WRITE signal is
Low when the Z8 is writing to the external program or data memory. (Not available for devices in the 28-pin package.)
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DS007601-Z8X0499
ZiLOG Port 0 (P00-P07). Port 0 is an 8-bit, bidirectional, CMOScompatible port. These eight I/O lines are configured under software control as a nibble I/O port (P03-P00 input/output and P07-P04 input/output), or as an address port for interfacing external memory. The input buffers are Schmitt-triggered and nibble-programmed as outputs and can be globally programmed as either push-pull or open-drain. LowEMI output buffers can be globally programmed by the software. Port 0 is placed under handshake control. In this configuration, Port 3, lines P32 and P35 are used as the handshake control DAV0 and RDY0. Handshake signal direction is dictated by the I/O direction (input or output) of Port 0 of the upper nibble P04-P07. The lower nibble must indicate the same direction as the upper nibble.
Z86C34/C35/C36/C44/C45/C46 CMOS Z8(R) MCUs with ASCI UART
nibble) depending on the required address space. If the address range requires 12 bits or less, the upper nibble of Port 0 can be programmed independently as I/O while the lower nibble is used for addressing. If one or both nibbles are required for I/O operation, they are configured by writing to the Port 0 mode register. In ROMless mode, after a hardware RESET, Port 0 is configured as address lines A15-A8, and extended timing is set to accommodate slow memory access. The initialization routine can include reconfiguration to eliminate this extended timing mode. (In ROM mode, Port 0 is defined as input after RESET.) Port 0 can be placed in a high-impedance state along with Port 1, AS, DS and R/W, allowing the Z8 to share common resources in multiprocessor and DMA applications (Figure 12).
For external memory references, Port 0 provides address bits A11-A8 (lower nibble) or A15-A8 (lower and upper
4 Port 0 (I/O or A15-A8) Z8 4
Handshake Controls DAV0 and RDY0 (P32 and P35)
Open-Drain OE Pull-Up Transistor Enable (Mask Option) PAD
Out 1.5 In 2.3 Hysteresis @ VCC = 5.0V
Auto Latch (mask option) R 500K
Figure 12. Port 0 Configuration
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Z86C34/C35/C36/C44/C45/C46 CMOS Z8(R) MCUs with ASCI UART
ZiLOG
PIN FUNCTIONS (Continued)
Port 1 (P17-P10). Port 1 is an 8-bit, bidirectional, CMOS-
compatible port (Figure 13), with multiplexed Address (A7-A0) and Data (D7-D0) ports. For the ROM device, these eight I/O lines are programmed as inputs or outputs, or can be configured under software control as an Address/Data port for interfacing external memory. The input buffers are Schmitt-triggered and byte-programmed as outputs and can be globally programmed as either push-pull or open-drain. Low-EMI output buffers can be globally programmed by the software.
Note: Port 1 is not available on the devices in the 28-pin package, and P01M Register must set Bit D4,D3 as 00. LowEMI mode is not supported on the emulator for Port1. PCON register D4 must be 1.
Port 1 may be placed under handshake control. In this configuration, Port 3, lines P33 and P34 are used as the handshake controls RDY1 and DAV1 (Ready and Data Available). Memory locations greater than the internal ROM address are referenced through Port 1, except for Z86C46. To interface external memory, Port 1 must be programmed for the multiplexed Address/Data mode. If more than 256 external locations are required, Port 0 outputs the additional lines. Port 1 can be placed in the high-impedance state along with Port 0, AS, DS, and R/W, allowing the Z8 to share common resources in multiprocessor and DMA applications.
8 Z8
Port 1 (I/O or AD7-AD0)
Handshake Controls DAV1 and RDY1 (P33 and P34)
Open Drain OE
Pull-Up Transistor Enable (Mask Option)
PAD
Out 1.5 In Auto Latch (mask option) R 500 K 2.3 Hysteresis @ VCC = 5.0V
Figure 13. Port 1 Configuration
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ZiLOG Port 2 (P27-P20). Port 2 is an 8-bit, bidirectional, CMOScompatible I/O port. These eight I/O lines are configured under software control as an input or output, independently. Port 2 is always available for I/O operation. The input buffers are Schmitt-triggered. Bits programmed as outputs may be globally programmed as either push-pull or open-drain.
Z86C34/C35/C36/C44/C45/C46 CMOS Z8(R) MCUs with ASCI UART
Low-EMI output buffers can be globally programmed by the software. Port 2 may be placed under handshake control. In this Handshake Mode, Port 3 lines P31 and P36 are used as the handshake controls lines DAV2 and RDY2. The handshake signal assignment for Port 3 lines P31 and P36 is dictated by the direction (input or output) assigned to Bit 7, Port 2 (Figure 14).
Port 2 (I/O) Z8
Handshake Controls DAV2 and RDY2 (P31 and P36)
Open Drain OE
Pull-Up Transistor Enable (Mask Option)
PAD
Out 1.5 In Auto Latch (mask option) R 500 K 2.3 Hysteresis @ VCC = 5.0V.
Figure 14. Port 2 Configuration
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Z86C34/C35/C36/C44/C45/C46 CMOS Z8(R) MCUs with ASCI UART
ZiLOG
PIN FUNCTIONS (Continued)
Port 3 (P37-P30). Port 3 is an 8-bit, CMOS-compatible
port, with four fixed inputs (P33-P30) and four fixed outputs (P34-P37). It is configured under software control for Input/Output, Counter/Timers, interrupt, port handshake, and Data Memory functions. Port 3, bit 0 input is Schmitttriggered, and pins P31, P32, and P33 are standard CMOS inputs (no Auto Latches). Pins P34, P35, P36, P37 are pushpull output lines. Low-EMI output buffers can be globally programmed by the software. Two onboard comparators can process analog signals on P31 and P32 with reference to the voltage on P33. The analog function is enabled by programming Port 3 Mode Register (P3M bit 1). For Interrupt functions, Port 3, bit 0 and pin 3 are falling edge interrupt inputs. P31 and P32 are programmable as rising, falling, or both edge triggered interrupts (IRQ register Bits 6 and 7). P33 is the comparator reference voltage input when in Analog mode. Access to Counter/Timers 1 is made through P31 (TIN) and P36
(TOUT). Handshake lines for Ports 0, 1, and 2 are available on P31 through P36. Port 3 also provides the following control functions: handshake for Ports 0, 1, and 2 (DAV and RDY); four external interrupt request signals (IRQ3-IRQ0); timer input and output signals (TIN and TOUT); Data Memory Select (DM, see Table 10 and Figure 15).
P34 output can be software-programmed to function as a Data Memory Select (DM). The Port 3 mode register (P3M) Bit D3,D4 selects this function. When accessing external Data Memory, the P34 goes active Low; when accessing external Program Memory, the P34 goes High.
An onboard UART (ASCI) can be enabled by software by setting the RE and TE bits of the ASCI Control Register A (CNTLA). When enabled, P30 is the receive input and P37 is the transmit output.
Table 10. Port 3 Pin Assignments Pin P30 P31 P32 P33 P34 P35 P36 P37 I/O IN IN IN IN OUT OUT OUT OUT CTC1 TIN Analog AN1 AN2 REF AN1-OUT TOUT AN2-OUT Int. IRQ3 IRQ2 IRQ0 IRQ1 D/R D/R R/D R/D R/D TX DM P0 HS P1 HS P2 HS D/R Ext UART RX
Notes: HS = Handshake Signals D = DAV R = RDY
Comparator Inputs and Outputs. Port 3, pins P31 and P32 each feature a comparator front end. The comparator reference voltage, pin P33, is common to both comparators. In analog mode, the P31 and P32 are the positive inputs to the comparators and P33 is the reference voltage supplied to both comparators. In digital mode, pin P33 can be used as a P33 register input or IRQ1 source. P34 and P37 outputs
Note: The user must add a two-NOP delay after selecting the P3M bit D1 to 1 before the comparator output is valid. IRQ0, IRQ1, and IRQ2 should be cleared in the IRQ register when the comparator is enabled or disabled.
the comparator outputs by software-programming the PCON Register Bit D0 to 1 (see Figure 16).
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Z86C34/C35/C36/C44/C45/C46 CMOS Z8(R) MCUs with ASCI UART
P30 P31 P32
Z8
P33 P34 P35 P36 P37
Port 3 (I/O or Control)
Auto Latch (mask option)
R 500K P30
R247 = P3M
D1
P30 Data Latch IRQ3 1 = Analog 0 = Digital
DIG.
P31 (AN1)
+
AN.
IRQ2, IN, P31 Data Latch T
-
P32 (AN2)
+
IRQ0, P32 Data Latch
P33 (REF)
-
From Stop-Mode Recovery Source
IRQ1, P33 Data Latch
Figure 15. Port 3 Configuration
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Z86C34/C35/C36/C44/C45/C46 CMOS Z8(R) MCUs with ASCI UART
ZiLOG
PIN FUNCTIONS (Continued)
P34 OUT P31 + - REF (P33)
P34 PAD
P37 OUT P32 + - REF (P33) PCON D0 0 P34, P37 Standard Output 1 P34, P37 Comparator Output
P37 PAD
Figure 16. Port 3 Configuration
Auto Latch. The Auto Latch places valid CMOS levels on all CMOS inputs (except P33-P31) that are not externally driven. Whether this level is 0 or 1 cannot be determined. A valid CMOS level, rather than a floating node, reduces excessive supply current flow in the input buffer. Auto Latches are available on Port 0, Port 1, Port 2, and P30. There are no Auto Latches on P31, P32, and P33. Note: Deletion of all Port Auto Latches is available as a ROM Mask option. The Auto Latch Delete option is selected by the customer when the ROM code is submitted. RESET (input, active Low). Initializes the MCU. Reset is
ditions. RESET depends on oscillator operation to achieve full reset conditions, except for conditions wherein a WDT reset is permanently enabled. Pull-up is provided internally.
Note: The RESET pin is not available on devices in the 28-pin package.
After the POR time, RESET is a Schmitt-triggered input. During the RESET cycle, DS is held active Low while AS cycles at a rate of TPC/2. Program execution begins at location 000Ch, after the RESET is released. For Power-On Reset, the reset output time is TPOR ms. When program execution begins, AS and DS toggles only for external memory accesses. The Z8 does not reset WDTMR, SMR, P2M, PCON, and P3M registers on a StopMode Recovery operation or from a WDT reset out of STOP mode.
accomplished either through Power-On Reset, Watch-Dog Timer reset, Stop-Mode Recovery, or external reset. During Power-On Reset and Watch-Dog Reset, the internally-generated reset is driving the RESET pin Low for the POR time. Any devices driving the RESET line must be open-drain to avoid damage from a possible conflict during RESET con-
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Z86C34/C35/C36/C44/C45/C46 CMOS Z8(R) MCUs with ASCI UART
FUNCTIONAL DESCRIPTION
The Z8 MCU incorporates the following special functions to enhance the standard Z8(R) architecture to provide the user with increased design flexibility.
RESET. The device is reset in one of the following condi-
65535 16383/32767 16382/32766 Location of First Byte of Instruction Executed After RESET 12 11 10 9 8 Interrupt Vector (Lower Byte) 7 6 5 Interrupt Vector (Upper Byte) 4 3 2 1 0
External/Internal ROM and RAM
tions:
* * * * *
Power-On Reset Watch-Dog Timer Stop-Mode Recovery Source External Reset Low Voltage Recovery
On-Chip ROM
IRQ5 IRQ5 IRQ4 IRQ4 IRQ3 IRQ3 IRQ2 IRQ2 IRQ1 IRQ1 IRQ0 IRQ0
Auto Power-On Reset circuitry is built into the Z8, eliminating the requirement for an external reset circuit to reset upon power-up. The internal pull-up resistor is on the Reset pin, so a pull-up resistor is not required; however, in a highEMI (noisy) environment, it is recommended that a small value pull-up resistor be used.
Note: The RESET pin is not available on devices in the 28-pin package. Program Memory. The first 12 bytes of program memory
are reserved for the interrupt vectors. These locations contain six 16-bit vectors that correspond to the six available interrupts. For ROM mode, address 12 to address 65535 (C36/C46)/32767 (C35/C45)/16383 (C34/C44) consists of on-chip mask-programmed ROM. The Z86C44/C45 can access external program and data memory from addresses 16384/32768 to 65535. The 65535 (C36/C46)/32767 (C35/C45)/16383 (C34/C44) program memory is mask programmable. A ROM protect feature prevents dumping of the ROM contents by inhibiting execution of LDC, LDCI, LDE, and LDEI instructions to Program Memory in external program mode. ROM look-up tables can be used with this feature. The ROM Protect option is mask-programmable, to be selected by the customer when the ROM code is submitted.
Figure 17. Program Memory Map for Z86C34/35/44/45
Data Memory (DM). The ROMless version can address up to 64 KB of external data memory. External data memory may be included with, or separated from, the external program memory space. DM, an optional I/O function that can be programmed to appear on pin P34, is used to distinguish between data and program memory space (Figure 18). The state of the DM signal is controlled by the type of instruction being executed. An LDC Op Code references PROGRAM (DM inactive) memory, and an LDE instruction references data (DM active Low) memory. The user must configure Port 3 Mode Register (P3M) bits D3 and D4 for this mode. This feature is not usable for devices in 28-pin package. When used in ROM mode, the Z86C46 cannot access any external data memory. The Z86C44/C45 can access exter-
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Z86C34/C35/C36/C44/C45/C46 CMOS Z8(R) MCUs with ASCI UART
ZiLOG
FUNCTIONAL DESCRIPTION (Continued)
nal program and data memory from addresses 16384/32768 to 65535.
Expanded Register File (ERF). The Z8 register file is ex-
panded to allow for additional system control registers, and for mapping of additional peripheral devices along with I/O ports into the register address area. The Z8 register address space R0 through R15 is implemented as 16 groups of 16 registers per group (Figure 19). These register groups are
known as the Expanded Register File (ERF). Bits 7-4 of register RP select the working register group. Bits 3-0 of register RP select the expanded register group. Three system configuration registers reside in the Expanded Register File at Bank F (PCON, SMR, WDTMR). The rest of the Expanded Register is not physically implemented, and is open for future expansion.
65535
65535
External Data Memory
External Data Memory
16384/32768 16383/32767 NotAddressable 0 ROM Mode 0 ROMless Mode
Figure 18. Data Memory Map
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ZiLOG
Z86C34/C35/C36/C44/C45/C46 CMOS Z8(R) MCUs with ASCI UART
Z8(R) STANDARD CONTROL REGISTERS RESET CONDITION REGISTER
% FF SPL SPH RP FLAGS IMR IRQ IPR P01M P3M P2M PRE0 T0 PRE1 T1 TMR Reserved D7 D6 D5 D4 D3 D2 D1 D0 0 0 0 U 0 0 U 0 0 1 U U U U 0 0 0 0 U U 0 U 1 0 1 U U U U 0 0 0 0 U U 0 U 0 0 1 U U U U 0 0 0 0 U U 0 U 0 0 1 U U U U 0 0 0 0 U U 0 U 1 0 1 U U U U 0 0 0 0 U U 0 U 1 0 1 U U U U 0 0 0 0 U U 0 U 0 0 1 U U 0 U 0 0 0 0 U U 0 U 1 0 1 0 U 0 U 0
REGISTER POINTER
7 6 5 4 3 2 1 0
% FE % FD % FC % FB % FA % F9 % F8 % F7 % F6 % F5
WorkingRegister Group Pointer
Expanded Register Group Pointer
* *
Z8 Reg. File
%FF %FO
% F4 % F3 % F2 % F1 % F0
EXPANDED REG. GROUP (F) REGISTER
RESET CONDITION
U U U 0 1 1 0 1
*
%7F
% (F) 0F % (F) 0E
WDTMR Reserved SMR2 Reserved SMR Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved PCON
* **
% (F) 0D % (F) 0C % (F) 0B % (F) 0A % (F) 09
U
U
U
U
U
U
0
0
0
0
1
0
0
0
0
0
Reserved
% (F) 08 % (F) 07 % (F) 06
%0F %00
% (F) 05 % (F) 04 % (F) 03 % (F) 02 % (F) 01
*
% (F) 00
1
1
1
1
1
1
1
0
Notes: U = Unknown For ROMless Reset condition: "10110110". *Will not be reset with a STOP-Mode Recovery. **Will not be reset with a STOP-Mode Recovery, except bit D0. X Not available on 28-pin packages.
EXPANDED REG. GROUP(0) REGISTER
RESET CONDITION
1 U U U 1 U U U 1 U U U 1 U U U U U U U U U U U U U U U U U U U
* *
X
% (0) 03 % (0) 02 % (0) 01 % (0) 00
P3 P2 P1 P0
Figure 19. Expanded Register File Architecture
Register File. The register file consists of four I/O port registers, 236 general-purpose registers and 15 control and status registers (R0-R3, R4-R239 and R240-R255, respectively), plus three system configuration registers in the expanded register group. The instructions access registers
directly or indirectly through an 8-bit address field. As a result, a short, 4-bit register address can use the Register Pointer (Figure 20). In the 4-bit mode, the register file is divided into 16 working register groups, each occupying 16
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FUNCTIONAL DESCRIPTION (Continued)
continuous locations. The Register Pointer addresses the starting location of the active working register group.
R253 RP D7 D6 D5 D4 D3 D2 D1 D0
Expanded Register Group Working Register Group
Default setting after RESET = 00000000
Figure 20. Register Pointer
r7 r6 r5 r4
r3 r2 r1 r0
R253 (Register Pointer)
The upper nibble of the register file address provided by the register pointer specifies the active working-register group.
FF
Register Group F
F0
R15 to R0
7F 70 6F 60 5F 50 4F 40 3F 30 2F 20 1F
Specified Working Register Group
The lower nibble of the register file address provided by the instruction points to the specified register
Register Group 1
10 0F
R15 to R0 R15 to R4 R3 to R0
Register Group 0 I/O Ports
00
Figure 21. Register Pointer--Detail
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ZiLOG General-Purpose Registers (GPR). These registers are undefined after the device is powered up. The registers keep their most recent value after any RESET, as long as the RESET occurs in the VCC voltage-specified operating range. These do not keep their most recent state from a Low Voltage Protection (VLV) RESET if the VCC drops below 1.8V. Note: Register Bank E0-EF is only accessed through working register and indirect addressing modes. RAM Protect. The upper portion of the RAM's address spaces %80F to %EF (excluding the control registers) are
Z86C34/C35/C36/C44/C45/C46 CMOS Z8(R) MCUs with ASCI UART
Note: R254 and R255 are set to 00h after any RESET or StopMode Recovery. Counter/Timers. There are two 8-bit programmable
counter/timers (T0-T1), each driven by its own 6-bit programmable prescaler. The T1 prescaler is driven by internal or external clock sources; however, the T0 prescaler is driven by the internal clock only (Figure 22). The 6-bit prescalers can divide the input frequency of the clock source by any integer number from 1 to 64. Each prescaler drives its counter, which decrements the value (1 to 256) that is loaded into the counter. When the counter reaches the end of the count, a timer interrupt request, IRQ4 (T0) or IRQ5 (T1), is generated. The counters can be programmed to START, STOP, restart to CONTINUE, or restart from the initial value. The counters can also be programmed to STOP upon reaching 0 (single pass mode) or to automatically reload the initial value and continue counting (modulo-n continuous mode). The counters, but not the prescalers, are read at any time without disturbing their value or count mode. The clock source for T1 is user-definable and is either the internal microprocessor clock divide-by-four, or an external signal input through Port 3. The Timer Mode register configures the external timer input (P31) as an external clock, a trigger input that can be retriggerable or nonretriggerable, or as a gate input for the internal clock. The counter/timers can be cascaded by connecting the T0 output to the input of T1. TIN Mode is enabled by setting R243 PRE1 bit D1 to 0.
protected from writing. The RAM Protect bit option is mask-programmable and is selected by the customer when the ROM code is submitted. After the mask option is selected, the user activates this feature from the internal ROM code to turn off/on the RAM Protect by loading either a 0 or 1 into the IMR register, bit D6. A 1 in D6 enables RAM Protect.
Stack. The Z8 internal register file is used for the stack. The
16-bit Stack Pointer (R254-R255) is used for the external stack, which can reside anywhere in the data memory for ROMless mode. An 8-bit Stack Pointer (R255) is used for the internal stack that resides within the 236 general-purpose registers (R4-R239). Stack Pointer High (SPH) is used as a general-purpose register when using internal stack only. The devices in 28-pin packages use the 8-bit stack pointer (R255) for internal stack only.
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FUNCTIONAL DESCRIPTION (Continued)
OSC Internal Data Bus Write 2 PRE0 Initial Value Register D0 (SMR) 6-Bit Down Counter 8-bit Down Counter T0 Initial Value Register T0 Current Value Register Write Read
D1 (SMR)
16
/4
IRQ4
Internal Clock External Clock Clock Logic /4
/2
TOUT P36
6-Bit Down Counter
8-Bit Down Counter
IRQ5
Internal Clock Gated Clock Triggered Clock
PRE1 Initial Value Register Write Write
T1 Initial Value Register Read
T1 Current Value Register
TIN P31
Internal Data Bus
Figure 22. Counter/Timer Block Diagram
Interrupts. The Z8 features six different interrupts from six
different sources. These interrupts are maskable, prioritized (Figure 23) and the six sources are divided as follows: four sources are claimed by Port 3 lines P33-P30, and two in
counter/timers (Table 11). The Interrupt Mask Register globally or individually enables or disables the six interrupt requests.
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Z86C34/C35/C36/C44/C45/C46 CMOS Z8(R) MCUs with ASCI UART
IRQ0 IRQ2 IRQ1, 3, 4, 5 Interrupt Edge Select IRQ (D6, D7)
IRQ
IMR 6 IPR
Global Interrupt Enable Interrupt Request
PRIORITY LOGIC
Vector Select
Figure 23. Interrupt Block Diagram
Table 11. Interrupt Types, Sources, and Vectors Name IRQ0 IRQ1, IRQ2 IRQ3 IRQ4 IRQ5 Source DAV0, IRQ0 IRQ1 DAV2, IRQ2, TIN UART (ASCI) T0 T1 Vector Location 0, 1 2, 3 4, 5 6, 7 8, 9 10, 11 Comments External (P32), Rise Fall Edge Triggered External (P33), Fall Edge Triggered External (P31), Rise Fall Edge Triggered External (P30), Fall Edge Triggered Internal Internal
When more than one interrupt is pending, priorities are resolved by a programmable priority encoder that is controlled by the Interrupt Priority register. An interrupt machine cycle activates when an interrupt request is granted. This action disables all subsequent interrupts, saves the Program Counter and Status Flags, and then branches to the program memory vector location reserved for that interrupt.
All Z8 interrupts are vectored through locations in the program memory. This memory location and the next byte contain the 16-bit address of the interrupt service routine for that particular interrupt request. To accommodate polled interrupt systems, interrupt inputs are masked and the Interrupt Request register is polled to determine which of the interrupt requests require service.
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FUNCTIONAL DESCRIPTION (Continued)
An interrupt resulting from AN1 maps to IRQ2, and an interrupt from AN2 maps to IRQ0. Interrupts IRQ2 and IRQ0 may be rising, falling, or both edge-triggered, and are programmable by the user. The software may poll to identify the state of the pin. When in analog mode, the IRQ1 generates by the Stop-Mode Recovery source selected by SMR Reg. bits D4, D3, D2, or SMR2 D1 or D0. Programming bits for the Interrupt Edge Select are located in the IRQ register (R250), bits D7 and D6. The configuration is indicated in Table 12.
Table 12. IRQ Register IRQ D7 0 0 1 1
Notes: F = Falling Edge R = Rising Edge
Clock. The Z8 on-chip oscillator features a high-gain, parallel-resonant amplifier for connection to a crystal, LC, RC,
ceramic resonator, or any suitable external clock source (XTAL1 = INPUT, XTAL2 = OUTPUT). The crystal should be AT-cut, 16 MHz maximum, with a series resistance (RS) of less than or equal to 100 Ohms when counting from 1 MHz to 16 MHz. The crystal should be connected across XTAL1 and XTAL2 using the vendor's recommended capacitor values from each pin directly to the device Ground pin to reduce groundnoise injection into the oscillator. The RC oscillator option is mask-programmable on the Z8 and is selected by the customer at the time when the ROM code is submitted.
Notes: The RC option is available up to 8 MHz. The RC oscillator configuration must be an external resistor connected from XTAL1 to XTAL2, with a frequencysetting capacitor from XTAL1 to Ground (Figure 24). For better noise immunity, the capacitors should be tied directly to the device Ground pin (VSS).
Interrupt Edge D6 0 1 0 1 P31 F F R R/F P32 F R F R/F
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Z86C34/C35/C36/C44/C45/C46 CMOS Z8(R) MCUs with ASCI UART
XTAL1 C1 VSS** XTAL2 C2 VSS** Ceramic Resonator or Crystal C1, C2 = 47 pF TYP * f = 8 MHz C2 VSS** LC C1, C2 = 22 pF L = 130 uH * f = 3 MHz * C1 VSS** L
XTAL1 C1 VSS** XTAL2 R
XTAL1
XTAL1
XTAL2
XTAL2
RC @ 5V VCC (TYP) C1 = 33 pF * R = 1K * f = 6 MHz *
External Clock
*Preliminary value including pin parasitics **Device ground pin
Figure 24. Oscillator Configuration
Power-On-Reset (POR). A timer circuit clocked by a ded-
icated on-board RC oscillator is used for the Power-On Reset (POR) timer function. The POR time allows VCC and the oscillator circuit to stabilize before instruction execution begins. The POR timer circuit is a one-shot timer triggered by one of three conditions: 1. Power fail to Power OK status. 2. Stop-Mode Recovery (if D5 of SMR = 1). 3. WDT time-out. The POR time is specified as TPOR. Bit 5 of the Stop-Mode Register determines whether the POR timer is bypassed after Stop-Mode Recovery (typical for external clock, RC/LC oscillators).
HALT. HALT turns off the internal CPU clock, but not the XTAL oscillation. The counter/timers and external interrupts IRQ0, IRQ1, IRQ2, and IRQ3 remain active. The de-
a NOP (Op Code = FFH) immediately before the appropriate sleep instruction. For example:
FF 6F FF 7F NOP STOP NOP HALT ; clear the pipeline ; enter STOP mode or ; clear the pipeline ; enter HALT Mode
vices are recovered by interrupts and are either externally or internally generated. An interrupt request must be enabled and executed to exit HALT mode. After the interrupt service routine, the program continues from the instruction after the HALT. In order to enter STOP (or HALT) mode, it is necessary to first flush the instruction pipeline to avoid suspending execution in mid-instruction. Therefore, the user must execute
STOP. This instruction turns off the internal clock and external crystal oscillation. It also reduces the standby current to 10 A or less. The STOP mode is terminated by a RESET only, either by WDT time-out, POR, SMR recovery, or external reset. As a result, the processor restarts the application program at address 000Ch. A WDT time-out in STOP mode affects all registers the same as if a Stop-Mode Recovery occurred via a selected Stop-Mode Recovery source except that the POR delay is enabled even if the delay is selected for disable. Note: If a permanent WDT is selected, the WDT runs in all modes and cannot be stopped or disabled if the onboard RC oscillator is selected to drive the WDT. Port Configuration Register (PCON). The PCON regis-
ter configures the ports individually; comparator output on Port 3, open-drain on Port 0 and Port 1, low EMI on Ports
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FUNCTIONAL DESCRIPTION (Continued)
0, 1, 2, and 3, and low-EMI oscillator. The PCON register is located in the expanded register file at Bank F, location 00h (Figure 25).
Note: For emulator, this bit must be set to 1. Low-EMI Port 2 (D5). Port 2 can be configured as a lowEMI port by resetting this bit (D5 = 0) or configured as a Standard Port by setting this bit (D5 = 1). The default value is 1.
Comparator Output Port 3 0 P34, P37 Standard Output* 1 P34, P37 Comparator Output 0 Port 1 Open Drain 1 Port 1 Push-pull Active* 0 Port 0 Open Drain 1 Port 0 Push-pull Active* 0 Port 0 Low EMI 1 Port 0 Standard* 0 Port 1 Low EMI 1 Port 1 Standard* 0 Port 2 Low EMI 1 Port 2 Standard* 0 Port 3 Low EMI 1 Port 3 Standard* Low EMI Oscillator 0 Low EMI 1 Standard*
PCON (FH) 00H D7 D6 D5 D4 D3 D2 D1 D0
Low-EMI Port 3 (D6). Port 3 can be configured as a lowEMI port by resetting this bit (D6 = 0) or configured as a Standard Port by setting this bit (D6 = 1). The default value is 1. Low-EMI OSC (D7). This bit of the PCON Register controls the low-EMI noise oscillator. A 1 in this location configures the oscillator, DS, AS and R/W with standard drive, while a 0 configures the oscillator, DS, AS and R/W with
low noise drive. The low-EMI mode reduces the drive of the oscillator (OSC). The default value is 1.
Note: Maximum external clock frequency of 4 MHz when running in the low-EMI oscillator mode. Low-EMI Emission. The Z8 can be programmed to operate in a low-EMI emission mode in the PCON register. The oscillator and all I/O ports can be programmed as low-EMI emission mode independently. Use of this feature results in:
*Default Setting After Reset Must be set to one for devices in 28-pin packages
Figure 25. Port Configuration Register (PCON) (WRITE ONLY)
Comparator Output Port 3 (D0). Bit 0 controls the comparator use in Port 3. A 1 in this location brings the comparator outputs to P34 and P37, and a 0 releases the Port to its standard I/O configuration. The default value is 0. Port 1 Open-Drain (D1). Port 1 can be configured as an open-drain by resetting this bit (D1 = 0) or configured as push-pull active by setting this bit (D1 = 1). The default value is 1. The user must set D1 = 1 for devices in 28-pin pack-
* * * *
The pre-drivers slew rate reduced to 10 ns (typical) Low-EMI output drivers exhibit resistance of 200 Ohms (typical) Low-EMI Oscillator Internal SCLK/TCLK = XTAL operation limited to a maximum of 4 MHz-250 ns cycle time, when LOW EMI OSCILLATOR is selected and system clock (SCLK
= XTAL, SMR REGISTER BIT D1 = 1)
ages.
Port 0 Open-Drain (D2). Port 0 can be configured as an open-drain by resetting this bit (D2 = 0) or configured as push-pull active by setting this bit (D2 = 1). The default value is 1. Low-EMI Port 0 (D3). Port 0 can be configured as a lowEMI port by resetting this bit (D3 = 0) or configured as a Standard Port by setting this bit (D3 = 1). The default value is 1. Low-EMI Port 1 (D4). Port 1 can be configured as a lowEMI port by resetting this bit (D4 = 0) or configured as a Standard Port by setting this bit (D4 = 1). The default value is 1. The user must set D4 = 1 for devices in 28-pin packages.
Stop-Mode Recovery Register (SMR). This register se-
lects the clock divide value and determines the mode of Stop-Mode Recovery (Figures 26 and 27). All bits are WRITE ONLY, except bit 7, which is READ ONLY. Bit 7 is a flag bit that is hardware set on the condition of STOP recovery and RESET by a power-on cycle. Bit 6 controls whether a low level or a high level is required from the recovery source. Bit 5 controls the reset delay after recovery. Bits 2, 3, and 4, or the SMR register, specify the source of the Stop-Mode Recovery signal. Bits 0 and 1 determine the time-out period of the WDT. The SMR is located in Bank F of the Expanded Register Group at address 0BH.
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Z86C34/C35/C36/C44/C45/C46 CMOS Z8(R) MCUs with ASCI UART SCLK/TCLK Divide-by-16 Select (D0). D0 of the SMR controls a divide-by-16 prescaler of SCLK/TCLK. The purSCLK/TCLK Divide-by-16 0 OFF * * 1 ON External Clock Divide by 2 0 SCLK/TCLK =XTAL/2* 1 SCLK/TCLK =XTAL STOP-Mode Recovery Source 000 POR Only and/or External Reset* 001 P30 010 P31 011 P32 100 P33 101 P27 110 P2 NOR 0-3 111 P2 NOR 0-7 Stop Delay 0 OFF 1 ON* Stop Recovery Level 0 Low* 1 High Stop Flag (Read only) 0 POR* 1 Stop Recovery
SMR (FH) 0B D7 D6 D5 D4 D3 D2 D1 D0
pose of this control is to selectively reduce device power consumption during normal processor execution (SCLK control) and/or HALT mode (where TCLK sources counter/timers and interrupt logic). This bit is reset to D0 = 0 after a Stop-Mode Recovery.
External Clock Divide-by-Two (D1). This bit can eliminate the oscillator divide-by-two circuitry. When this bit is 0, the System Clock (SCLK) and Timer Clock (TCLK) are equal to the external clock frequency divided by 2. The SCLK/TCLK is equal to the external clock frequency when this bit is set (D1 = 1). Using this bit together with D7 of PCON further helps lower EMI (that is, D7 (PCON) = 0, D1 (SMR) = 1). The default setting is 0. Maximum external clock frequency is 4 MHz when SMR BIT D1 = 1 where SCLK/TCLK = XTAL. Stop-Mode Recovery Source (D2, D3, and D4). T h e s e three bits of the SMR specify the wake-up source of the STOP recovery (Figure 28 and Table 13). When the Stop-
Note: Not used in conjunction with SMR2 Source * Default setting after RESET. * * Default setting after RESET and STOP-Mode Recovery.
Figure 26. Stop-Mode Recovery Register (WRITE ONLY Except Bit D7, Which Is READ ONLY)
Mode Recovery Sources are selected in this register, then SMR2 register bits D0,D1 must be set to 0.
Note: If the Port 2 pin is configured as an output, this output level is read by the SMR circuitry.
SMR2 (0F) DH D7 D6 D5 D4 D3 D2 D1 D0
Stop-Mode Recovery Source 2 00 POR only* 01 AND P20,P21,P22,P23 10 AND P20,P21,P22,P23,P24, P25,P26,P27 Reserved (Must be 0)
Note: Not used in conjunction with SMR Source
Figure 27. Stop-Mode Recovery Register 2 (0F) DH: WRITE ONLY
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FUNCTIONAL DESCRIPTION (Continued)
SMR2 D1 D0 00 VDD P20
SMR2 D1 D0 11 P20
SMR2 D1 D0 11
P23
P27
SMR D4 D3 D2 000 VDD
P30 P31 P32
SMR D4 0 0 0
D3 0 1 1
D2 SMR D4 D3 D2 1 100 0 1 P27
SMR D4 D3 D2 101 P20
SMR D4 D3 D2 110 P20
SMR D4 D3 D2 111
P33
P23
P27
T POR o RESET Stop-Mode Recovery Edge Select (SMR) T P33 Data o Latch and IRQ1 P33 From Pads
MUX
Digital/Analog Mode Select (P3M)
Figure 28. Stop-Mode Recovery Source
Table 13. Stop-Mode Recovery Source SMR:432 D4 D3 D2 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 Operation Description of Action POR and/or external reset recovery P30 transition P31 transition (not in Analog Mode) P32 transition (not in Analog Mode) P33 transition (not in Analog Mode) P27 transition Logical NOR of P20 through P23 Logical NOR of P20 through P27
wake up is selected, the Stop-Mode Recovery source must be kept active for at least 5 TpC.
Stop-Mode Recovery Edge Select (D6). A 1 in this bit
position indicates that a high level on any one of the recovery sources wakes the Z8 from STOP mode. A 0 indicates low-level recovery. The default is 0 on POR (Figure 28). This bit is used for either SMR or SMR2.
Cold or Warm Start (D7). This bit is set by the device upon entering STOP mode. A 0 in this bit (cold) indicates that the device resets by POR/WDT RESET. A 1 in this bit
(warm) indicates that the device awakens by a Stop-Mode Recovery source.
Note: If the Port 2 pin is configured as an output, this output level is read by the SMR2 circuitry.
Stop-Mode Recovery Delay Select (D5). T h i s b i t , i f High, enables the TPOR RESET delay after Stop-Mode Recovery. The default configuration of this bit is 1. If the fast
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ZiLOG Stop-Mode Recovery Register 2 (SMR2). This register
Z86C34/C35/C36/C44/C45/C46 CMOS Z8(R) MCUs with ASCI UART
contains additional Stop-Mode Recovery sources. When the Stop-Mode Recovery sources are selected in this register then SMR Register. Bits D2, D3, and D4 must be 0.
Table 14. Stop-Mode Recovery Source SMR:10 D1 D0 0 0 1 0 1 0 Operation Description of Action POR and/or external reset recovery Logical AND of P20 through P23 Logical AND of P20 through P27
es its terminal count. The WDT is initially enabled by executing the WDT instruction and refreshed on subsequent executions of the WDT instruction. The WDT circuit is driven by an onboard RC oscillator or external oscillator from the XTAL1 pin. The POR clock source is selected with bit 4 of the WDT register (Figure 29).
WDT instruction affects the Z (Zero), S (Sign), and V (Overflow) flags. The WDTMR must be written to within 64 internal system clocks. After that, the WDTMR is WRITE-pro-
tected.
Note: WDT time-out while in STOP mode does not reset SMR, PCON, WDTMR, P2M, P3M, Ports 2 & 3 Data Registers, but the POR delay counter is still enabled even though the SMR stop delay is disabled.
Watch-Dog Timer Mode Register (WDTMR). The WDT
is a retriggerable one-shot timer that resets the Z8 if it reach-
WDTMR (F) 0F D7 D6 D5 D4 D3 D2 D1 D0
WDT TAP INT RC OSC External Clock 00 3.5 ms 128 TpC 7 ms 256 TpC 01* 10 14 ms 512 TpC 11 56 ms 2048 TpC WDT During HALT 0 OFF 1 ON* WDT During STOP 0 OFF 1 ON* XTAL1/INT RC Select for WDT 0 On-Board RC* 1 XTAL Reserved (must be 0)
* Default setting after RESET
Figure 29. Watch-Dog Timer Mode Register (WRITE ONLY)
WDT Time Select. (D0,D1). Selects the WDT time period and is configured as indicated in Table 15. D1 0 0 1 1 D0 0 1 0 1
Table 15. WDT Time Select Timeout of Internal RC OSC 3.5 ms min 7 ms min 14 ms min 56 ms min Timeout of System Clock 128 SCLK 256 SCLK 512 SCLK 2048 SCLK
Notes: SCLK = system bus clock cycle. The default on RESET is 7 ms. Values provided are for VCC = 5.0V.
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FUNCTIONAL DESCRIPTION (Continued)
WDTMR During HALT (D2). This bit determines whether or not the WDT is active during HALT mode. A 1 indicates active during HALT. The default is 1. WDTMR During STOP (D3). This bit determines whether or not the WDT is active during STOP mode. Because XTAL clock is stopped during STOP mode, the on-board RC must be selected as the clock source to the POR counter. A 1 indicates active during STOP. The default is 1. Note: If permanent WDT is selected, the WDT runs in all modes and can not be stopped or disabled if the on board RC oscillator is selected as the clock source for WDT. Clock Source for WDT (D4). This bit determines which oscillator source is used to clock the internal POR and WDT counter chain. If the bit is a 1, the internal RC oscillator is bypassed and the POR and WDT clock source is driven from the external pin, XTAL1. The default configuration of this bit is 0 which selects the internal RC oscillator. WDTMR Register Accessibility. The WDTMR register is
accessible only during the first 60 internal system clock cycles from the execution of the first instruction after PowerOn Reset, Watch-Dog Reset, or Stop-Mode Recovery. After this point, the register cannot be modified by any means, intentional or otherwise. The WDTMR cannot be read and is located in bank F of the Expanded Register Group at address location 0FH (Figure 30).
Note: The WDT can be permanently enabled (automatically enabled after RESET) through a mask programming option. The option is selected by the customer at the time of ROM code submission. In this mode, WDT is always activated when the device comes out of RESET. Execution of the WDT instruction serves to refresh the WDT time-out period. WDT operation in the HALT and STOP Modes is controlled by WDTMR programming. If this mask option is not selected at the time of ROM code submission, the WDT must be activated by the user through the WDT instruction and is always disabled by any reset to the device.
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Z86C34/C35/C36/C44/C45/C46 CMOS Z8(R) MCUs with ASCI UART
Reset
4 Clock Filter
Clear CLK
18 Clock RESET Generator
RESET
Internal RESET WDT Select (WDTMR) CLK Source Select (WDTMR) XTAL Internal RC OSC. M U X 5ms POR CK CLR 5ms 15ms 25ms 100ms WDT/POR Counter Chain WDT TAP SELECT
VDD VLV
+ -
2V Operating Voltage Det.
WDT
From Stop Mode Recovery Source Stop Delay Select (SMR)
Figure 30. Resets and WDT
Low Voltage Protection. An onboard Voltage Comparator checks that VCC is at the required level to ensure correct operation of the device. RESET is globally driven if VCC is below the specified voltage (Low Voltage Protection). The minimum operating voltage is varying with the temperature and operating frequency, while the Low Voltage Protection (VLV) varies with temperature only.
Note: The internal clock frequency relationship to the XTAL clock is dependent on SMR BIT 0 1 setting.
The Low Voltage Protection trip voltage (VLV) is less than 3V and more than 1.4V under the following conditions.
Table 16. Maximum (VLV) Conditions: Case 1: Case 2: TA = -40C, +105C, Internal Clock Frequency equal or less than 4 MHz TA = -40C, +85C, Internal Clock Frequency equal or less than 6 MHz
The device functions normally at or above 3.0V under all conditions. Below 3.0V, the device functions normally until the Low Voltage Protection trip point (VLV) is reached, for the temperatures and operating frequencies in Case 1 and Case 2, above. The device is guaranteed to function normally at supply voltages above the Low Voltage Protection trip point. The actual Low Voltage Protection trip point is a function of temperature and process parameters (Figure 36).
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ZiLOG
ASYNCHRONOUS SERIAL COMMUNICATIONS INTERFACE (ASCI)
Key features of the ASCI include:
* * * * * * * * * *
Full-duplex operation Programmable data format 7 or 8 data bits with optional ninth bit for multiprocessor communication
P30 and P37 can be used as general-purpose I/O as long
ceive Data Register Full Flag also goes active during this time. If there is no space in the FIFO at the time that the RSR attempts to transfer the received data into it, an overrun error occurs.
Receive Data FIFO. When a complete incoming data byte is assembled in the RSR, it is automatically transferred to
as the ASCI channels are disabled One or two STOP bits Odd, even or no parity Programmable interrupt conditions Four level data/status FIFOs for the receiver Receive parity, framing and overrun error detection Break detection and generation
the 4-byte FIFO, which serves to reduce the incidence of overrun errors. The top (oldest) character in the FIFO (if any) can be read via the Receive Data Register (RDR). The next incoming data byte can be shifted into the RSR while the FIFO is full, thus providing an additional level of buffering. However, an overrun occurs if the receive FIFO is still full when the receiver completes assembly of that character and is ready to transfer it to the FIFO. If this situation occurs, the overrun error bit associated with the previous byte in the FIFO is set. The latest data byte is not transferred from the shift register to the FIFO in this case, and is lost. When an overrun occurs, the receiver does not place any further data in the FIFO until the most recent good byte received arrives at the top of the FIFO and sets the Overrun latch, and software then clears the Overrun latch by a WRITE of 0 to the EFR bit. Assembly of bytes continues in the shift register, but this data is ignored until the byte with the overrun error reaches the top of the FIFO and the status is cleared. When a break occurs (defined as a framing error with the data equal to all zeros), the all-zero byte with its associated error bits are transferred to the FIFO if it is not full and the Break Detect bit in the ASEXT register is set. If the FIFO is full, an overrun is generated, but the break, framing error and data are not transferred to the FIFO. Any time a break is detected, the receiver does not receive any more data until the RX pin returns to a high state. If the channel is set in multiprocessor mode and the MPE bit of the CNTLA register is set to 1,then break, errors and data are ignored unless the MP bit in the received character is a 1. The two conditions listed above could cause the missing of a break condition if the FIFO is full and the break occurs or if the MP bit in the transmission is not a one with the conditions specified above.
ASCI Status FIFO/Registers. This FIFO contains Parity Error, Framing Error, RX Overrun, and Break status bits as-
Transmit Data Register. Data written to the ASCI Trans-
mit Data Register (TDR) is transferred to the Transmit Shift Register(TSR) as soon as the TSR is empty. Data can be written while the TSR is shifting out the previous byte of data, providing double buffering for the transmit data. The TDR is READ- and WRITE-accessible. Reading from the TDR does not affect the ASCI data transmit operation currently in progress.
Transmit Shift Register. When the ASCI Transmit Shift
Register (TSR) receives data from the ASCI Transmit Data Register, the data is shifted out to the TX (P37) pin. When transmission is completed, the next byte (if available) is automatically loaded from the TDR into the TSR and the next transmission starts. If no data is available for transmission, the TSR idles at a continuous High level. This register is not program-accessible.
Receive Shift Register. When the RE bit is set in the CNTLA register, the RX (P30) pin is monitored for a Low. One-half bit-time after a Low is sensed at RX, the ASCI samples RX again. If RX goes back to High, the ASCI
ignores the previous Low and resumes looking for a new Low, but if RX is still Low, it considers RX a START bit and proceeds to clock in the data based upon the selected baud rate. The number of data bits, parity, multiprocessor and STOP bits are selected by the MOD2, MOD1, MOD0 and multiprocessor mode (MP) bits in the CNTLA and CNTLB registers. After the data is received, the appropriate MP, parity and one STOP bit are checked. Data and any errors are clocked into the receive data and status FIFO during the STOP bit if there is an empty position available. Interrupts and Re44
sociated with each character in the receive data FIFO. The status of the oldest character (if any) can be read from the ASCI status register, which also provides several other, non-FIFOed status conditions. The outputs of the error FIFO go to the set inputs of software-accessible error latches in the status register. Writing
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a 0 to the EFR bit in CNTLA is the only way to clear these latches. In other words, when an error bit reaches the top of the FIFO, it sets an error latch. If the FIFO contains more data and the software reads the next byte out of the FIFO, the error latch remains set until the software writes a 0 to the EFR bit. The error bits are cumulative, so if additional errors are in the FIFO they set any unset error latches as they reach the top.
Baud Rate Generator. The baud rate generator features
main processor clock frequency. The BRG can also be disabled in favor of the SCLK. The Receiver and Transmitter subsequently divide the output of the Baud rate Generator (or the signal from the CLK pin) by 1, 16 or 64 under the control of the DR bit in the CNTLB register and the X1 bit in the ASCI Extension Control Register (ASEXT).
RESET. During RESET, the ASCI is forced to the following
two modes. The first provides a dual set of fixed clock divide ratios as defined in CNTLB. In the second mode, the BRG is configured as a sixteen-bit down counter that divides the processor clock by the value in a software accessible, sixteen-bit, time-constant register. As a result, virtually any frequency can be created by appropriately selecting the
conditions:
* * * *
FIFO Empty All Error Bits Cleared (including those in the FIFO) Receive Enable Cleared (CNTLA BIT 6 = 0) Transmit Enable Cleared (CNTLA BIT 5 = 0)
Internal Address/Data Bus
ASCI Transmit Data Register TDR (Bank:Ah,Addr :01h)
IRQ3 Interrupt Request
**
(P37) TX
ASCI Transmit Shift Register TSR ASCI Receive Data FIFO RDR (Bank:Ah,Addr:02h)
**
(P30) RX
ASCI Receive Shift Register RSR ASCI ASCI Control Register A CNTLA (Bank:Ah,Addr:03h) Accessible ASCI Control Register B CNTLB (Bank:Ah,Addr:04h) ASCI Status FIFO/Register STAT (Bank:Ah,Addr:08h) ASCI Extension Control Reg. ASEXT (Bank:Ah,Addr:05h) ASCI Time Constant High ASTCH (Bank:Ah,Addr:07h) ASCI Time Constant Low ASTCL (Bank:Ah,Add:06h)r Control
SCLK
Baud Rate Generator
Note: **Not Program
Figure 31. ASCI Interface Diagram
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ZiLOG
INTERRUPTS
The ASCI channel generates one interrupt (IRQ3) from two sources of interrupts: a receiver and a transmitter. In addition, there are several conditions that may cause these interrupts to trigger. Figure 32 illustrates the different conditions for each interrupt source enabled under program control.
FIFO full Overrun error Framing Error Parity Error Start Bit Receiver Interrupt Sources ASCI Interrupt (IRQ3)
Buffer Empty
Transmitter Interrupt Sources
Figure 32. ASCI Interrupt Conditions and Sources
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EXPANDED REGISTER GROUP (A)
B7
%(A)0F %(A)0E %(A)0D %(A)0C %(A)0B %(A)0A %(A)09 * %(A)08 * %(A)07 * %(A)06 * %(A)05 * %(A)04 RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED GEN PURPOSE STAT ASTCH ASTCL ASEXT CNTLB CNTLA RDR TDR RESERVED
B6
B5
B4
B3
B2
B1
B0
u 0 1 1 0 0 0 u u
u 0 1 1 0 0 0 u u
u 0 1 1 0 0 0 u u
u 0 1 1 0 0 1 u u
u 0 1 1 0 0 0 u u
u 0 1 1 0 1 0 u u
u 1 1 1 0 1 0 u u
u 0 1 1 0 1 0 u u
* %(A)03 * %(A)02 * %(A)01 %(A)00
* Not reset with a STOP-Mode Recovery.
Figure 33. Expanded Register Group (A) Registers
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ASCI TRANSMIT DATA REGISTER (TDR) (%(A)01H: READ/WRITE)
Table 17. TDR Register Bit Functions Bit R Transmit Data W Reset U U U U U U U U 7 6 5 4 3 2 1 0
Data written to the ASCI Transmit Data Register (TDR) is transferred to the Transmit Shift Register (TSR) as soon as the TSR is empty. The TSR is not not software-accessible. The ASCI transmitter is double-buffered so data can be
written to the TDR while the TSR is shifting out the previous byte. Data can be written into and read out of the TDR. When the TDR is read, the data transmit operation is not affected.
ASCI RECEIVE DATA REGISTER (RDR) (%(A)02H: READ/WRITE)
Table 18. RDR Register Bit Functions Bit R Receive Data W Reset U U U U U U U U 7 6 5 4 3 2 1 0
When a complete incoming data byte is assembled in the Receive Shift Register (RSR), it is automatically transferred to the highest available location in the Receive Data FIFO. The Receive Data Register (RDR) is the highest location in the Receive Data FIFO. The RDRF bit in the STAT register
is set when one or more bytes is available from the FIFO. The FIFO status for the character in the RDR is available in the STAT register via bits 6, 5 and 4. STAT should be read before reading the RDR. The data in both FIFO locations is popped when the character is read from the RDR.
ASCI CONTROL REGISTER A (CNTLA) (%(A)03H: READ/WRITE)
Table 19. CNTLA Register Bit Functions Bit R Multiprocessor Enable (MPE) W Reset 0 0 0 1 Receiver Enable (RE) Transmitter Enable (TE) Reserved Error Flag Receive (EFR) 0 0 7 6 5 4 3 2 1 0
Multiprocessor MOD2 MOD1 MOD0 Bit Received (MPBR) Mode Select
0
0
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Bit 7 is the Multiprocessor Enable
The ASCI features a multiprocessor communication mode that utilizes an extra data bit for selective communication when a number of processors share a common serial bus. Multiprocessor data format is selected when the MP bit in the corresponding register is set to 1. If multiprocessor mode is not selected (MP bit in CNTLB = 0), multiprocessor enable (MPE) has no effect. If multiprocessor mode is selected (MP bit in CNTLB = 1), MPE enables or disables the wake-up feature as follows. If MPE is set to 1, only received bytes in which the multiprocessor bit (MPB) = 1 are treated as valid data characters and loaded into the receiver FIFO with corresponding error flags in the status FIFO. Bytes with MPB = 0 are ignored by the ASCI. If MPE is reset to 0, all bytes are received by the ASCI, regardless of the state of the MPB data bit.
Bit 4 is Reserved Bit 3 is the Multiprocessor Bit Receive (Read only)
When multiprocessor mode is enabled (MP in CNTLB = 1), this bit, when read, contains the value of the MPB bit for the data byte currently available at the Receive Data Register (the top of the receiver FIFO).
Bit 3 is the Error Flag Reset (WRITE ONLY)
When written to 0, the error flags (OVRN, FE; PE in STAT and BRK in ASEXT) are cleared to 0. This command selfresets, and as a result, writing EFR to a 1 is not required.
Bits 2-0 are the ASCI Data Format Mode 2,1,0
These bits program the ASCI data format.
Table 20. Format Mode Control Bits Bit 2 1 0 Name Function MOD2 Number of Data Bits MOD1 Parity Enabled MOD0 Number of Stop Bits Bit = 0 7 No Parity 1 Bit = 1 8 With Parity 2
Bit 6 is the Receiver Enable
When Receiver Enable(RE) is set to 1,the ASCI receiver is enabled. When RE is reset to 0, the receiver is disabled and any receive operation in progress is aborted. However, the previous contents of the receiver data and status FIFO are not affected.
Bit 5 is the Transmitter Enable
When Transmitter Enable(TE) is set to 1,the ASCI transmitter is enabled. When TE is reset to 0, the transmitter is disabled and any transmit operation in progress is aborted. However, the previous contents of the transmitter data register and the TDRE flag are not affected.
If MOD1 = 1, parity is checked on received data and a parity bit is appended to the data bits in the transmitted data. Parity Even/Odd (PEO) in CNTLB selects even or odd parity. The ASCI serial data format is illustrated in Figure 34.
7 or 8 bits Data Field
1 or 2 Stop Bit(s) Start Bit it Parity Bit
Figure 34. ASCI Serial Data Format
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ASCI CONTROL REGISTER B (CNTLB) (%(A)04H: READ/WRITE)
Table 21. CNTLB Register Bit Functions Bit R W Reset 7 Multiprocessor Bit Transmitter (MPBT) 0 6 Multiprocessor Mode (MP) 0 5 4 Parity Even/Odd (PEO) 0 3 Divide Ratio (DR) 0 1 2 SS2 1 SS1 0 SS0
Prescale (PR) 0
Clock Source and Speed 1 1
BIT 7 is the Multiprocessor Bit Transmit
When multiprocessor format is selected (MP BIT = 1), Multiprocessor Bit Transmit (MPBT) is used to specify the MPB data bit for transmission. If MPBT = 1, then a 1 is transmitted in the MPB bit position. If MPBT = 0, a 0 is transmitted.
position whose value is specified in MPBT immediately after the specified number of data bits and preceding the specified number of STOP bits.
Note: The multiprocessor format does not provide parity. The serial data format while in MP mode is illustrated in Figure 35.
BIT 6 is the Multiprocessor Mode
When Multiprocessor Mode (MP) is set to 1, the serial data format is configured for multiprocessor mode, adding a bit
7 or 8 bits Data Field
Start Bit
MPB
1 or 2 Stop Bit(s)
Figure 35. MP Mode Serial Data Format
If MP = 0, the data format is based on MOD2-0 in CNTLA and may include parity.
Bit 4 is the Parity Even/Odd
Parity Even/Odd (PEO) controls the parity bit transmitted on the serial output and the parity check on the serial input. If PEO is cleared to 0, even parity is transmitted and checked If PEO is set to 1, odd parity is transmitted and checked.
Bit 5 is the BRG Prescaler
The Prescale bit specifies the baud rate generator prescale factor when using the SS2-0 bits to define the ASCI baud rate (BRG MODE = 0). Writing a 0 to this bit sets the BRG Prescaler to divide by 10. Setting this bit to a 1 sets the BRG Prescaler to divide by 30. See the Baud Rate Generation Summary for more information on setting the ASCI baud rate.
Bit 3 is the Divide Ratio
The Divide Ratio bit specifies the divider used to obtain the baud rate from the data sampling clock when using the SS2-0 bits to define the ASCI baud rate (BRG MODE = 0). If DR is 0, then DIVIDE-BY-16 is used. If DR is set to a 1, then DIVIDE-BY-64 is used. See the Baud Rate Generation Summary for more information on setting the ASCI baud rate.
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Z86C34/C35/C36/C44/C45/C46 CMOS Z8(R) MCUs with ASCI UART Table 22. Clock Source and Speed Bits SS1 0 0 1 1 0 0 1 1 SS0 0 1 0 1 0 1 0 1 Divider (DIV) /1 /2 /4 /8 /16 /32 /64 Reserved
Bit 2,1 are the Clock Source and Speed Select
When the BRG mode bit in the ASEXT register is set to 0, these 3 bits, along with DR and PR in this register define the ASCI baud rate. Bits 2, 1 and 0 specify a power-of-two divider of the SCLK as defined in Table 22. These bits should never be set to all 1s or erratic results may occur. See the Baud Rate Generation Summary for more information on setting the ASCI baud rate.
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ASCI EXTENSION CONTROL REGISTER (ASEXT) (%(A)05H: READ/WRITE)
Table 23. ASEXT Register Bit Functions Bit R 7 RX State (RX) Reserved W Reset P30 0 6 5 4 3 2 1 Break Detect (BD) 0
RX Reserved BRG Mode Interrupt on Reserved (must be 0) (BRGM) Start Bit (RIS) 0 0 0 0
Send Break (SB)
0
0
BIT 7 is the RX State (READ ONLY)
Provides the real time state of RX, the channel's receive data input pin--P30.
BIT 6 is Reserved
When read, this bit reflects the default value 0. When WRITE, this bit is ignored.
Bit 5 is Reserved
When read, this bit reflects the default value 0. When WRITE, this bit is ignored.
on RX. Such a receive interrupt is always followed by the setting of RDRF in the middle of the STOP bit. This interrupt request must be cleared by writing this bit back to a 0. Writing a 1 to this bit has no effect. One function of this feature is to wake the part from Sleep mode when a character arrives, so that the ASCI receives clocking with which to process the character. Another function is to ensure that the associated interrupt service routine is activated in time to sense the setting of RDRF in the status register, and to start a timer for baud rate measurement at that time.
Bit 1 is the Break Detect (READ ONLY)
This status bit is set to a 1 when a Break is detected, defined as a framing error with the data bits all equal to 0. The allzero byte with its associated error bits are transferred to the FIFO if it is not full. If the FIFO is full, an overrun is generated, but the break, framing error and data are not transferred to the FIFO. Any time a break is detected, the receiver do not receive any more data until the RX pin returns to a High state. When set, this bit remains set until it is cleared by writing a 0 to the EFR bit in the CNTLA register.
Bit 4 is the X1 Bit Clock
Reserved--must be set to 0 or erratic results may occur.
Bit 3 is the BRG Mode
When this bit is set to a 1, the ASCI's baud rate is set by the 16-bit programmable divider programmed in ASCI Time Constant High (ASTH) and ASCI Time Constant Low (ASTL). If this bit is set to a 0, the baud rate is defined by the PR bit, the DR bit, and the SS2-0 bits in the CNTLB register. In either case, the source for the baud rate generator is the SCLK. See the Baud Rate Generation Summary for more information on setting the ASCI baud rate.
Bit 0 is the Send Break
Setting this bit to a 1 forces the channel's transmitter data output pin, TX, to a Low for as long as it remains set. Before starting the break, any character(s) in the TSR and in the TDR are completely transmitted. If a character is loaded into the TDR while a break is being generated, that character is held until the break is terminated and transmitted.
Bit 2 is the Rx Interrupt on Start
If software sets this bit to 1,a receive interrupt is requested (in a combinatorial fashion) when a START bit is detected
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ASCI TIME CONSTANT REGISTER (ASTL) (%(A)06H: READ/WRITE)
Table 24. ASTL Register Bit Functions Bit R ASCI Time Constant Low W Reset 1 1 1 1 1 1 1 1 7 6 5 4 3 2 1 0
ASCI TIME CONSTANT REGISTER (ASTH) (%(A)07H: READ/WRITE)
Table 25. ASTH Register Bit Functions Bit R ASCI Time Constant High W Reset 1 1 1 1 1 1 1 1 7 6 5 4 3 2 1 0
The ASTL and ASTH registers are only used when the BRG mode bit in the ASEXT register is set to a 1. These two 8bit registers form a 16-bit counter with a flip-flop logic circuit (DIVIDE-BY-2) on the output so that the final BRG output is symmetrical. The values written to these registers determine the time constant from which the baud rate is generated.
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ASCI STATUS REGISTER (STAT) (%(A)08H: READ/WRITE)
Table 26. ASCI Status Register (STAT) Bit 7 Receive Data Register Full (RDRF) 6 Overrun Error (OE) 5 Parity Error (PE) 4 Framing Error (FE) 3 2 1 Transmit Data Register Empty TDRE) 0
R
Receiver Interrupt Enable (RIE)
Reserved
Transmitter Interrupt Enable (TIE)
W
Reset
0
0
0
0
0
0
0
0
BIT 7 is the Receive Data Register Full
RDRF is set to 1 when the receiver transfers a character from the RSR into an empty Rx FIFO. Note: If a framing or parity error occurs, RDRF is still set and the receive data (which generated the error) is still loaded into the FIFO.
Bit 5 is the Parity Error
A parity error is detected when parity generation and checking is enabled by the MOD1 bit in the CNTLA register and a character has been assembled in which the parity does not match that specified by the PEO bit in CNTLB.
Note: PE is FIFOed and the error bit is not actually set until the associated data becomes available for reading in the
RDR.
When there is more than one character in the FIFO, and software reads a character, RDRF either remains set or is cleared and immediately set again. RDRF is cleared to 0 when the FIFO becomes empty after reading the RDR and during Power-On Reset.
When set, the bit remains set until it is cleared by writing a 0 to the EFT bit in the CNTLA register. The bit is cleared at Power-On Reset.
Bit 6 is the Overrun Error
An overrun occurs if the receive FIFO is still full when the receiver completes assembly of a character and is ready to transfer it to the FIFO. If this situation occurs, the overrun error bit associated with the previous byte in the FIFO is set. In this case, the latest data byte is not transferred from the shift register to the FIFO and is lost. When an overrun occurs, the receiver does not place any further data in the FIFO until the most recent good byte received (the byte with the associated overrun error bit set) moves to the top of the FIFO and sets the Overrun latch, and software then clears the Overrun latch. Assembly of bytes continues in the shift register, but this data is ignored until the byte with the overrun error reaches the top of the FIFO and the status is cleared. When set, the bit remains set until it is cleared by writing a 0 to the EFR bit in the CNTLA register. The bit is also cleared during Power-On Reset.
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Bit 4 is the Framing Error
A framing error is detected when the STOP bit of a character is sampled as a 0 (space). Like PE, FE is FIFOed and the error bit is not actually set until the associated data becomes available for reading in the RDR. When set, the bit remains set until it is cleared by writing a 0 to the EFR bit in the CNTLA register. The bit is cleared at Power-On Reset.
Bit 3 is the Receiver Interrupt Enable
RIE should be set to a 1 to enable ASCI receive interrupt requests. An interrupt (IRQ3) is generated when RDRF (bit 7 of the STAT register) is a 1. A receive interrupt is also generated if this bit is set to a 1, bit 2 of the ASEXT register (RX interrupt on the START bit) is set to a 1, and a START bit is detected by the receiver.
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Z86C34/C35/C36/C44/C45/C46 CMOS Z8(R) MCUs with ASCI UART SCLK (10 + 20 x PS) x DIV x Divide Ratio
Bit 2 is Reserved
When read, this bit reflects the default value 0. When WRITE, this bit is ignored.
Baud Rate =
Bit 1 is the Transmit Data Register Empty
TDRE = 1 indicates that the Transmit Data Register (TDR)
Where: 1. SCLK is the system clock. 2. PS = 1 or 0 and is bit 5 of CNTLB. 3. DIV = 1, 2, 4, 8, 16, 32 or 64 as reflected by SS2-0 in
CNTLB.
is empty and that the next data byte to be transmitted can be written into the TDR. TDRE is cleared to 0 after the byte is written to TDR, until the ASCI transfers the byte from the TDR to the Transmit Shift Register (TSR), and then TDRE is again set to 1. TDRE is set to 1 at Power-On Reset.
4. DIVIDE RATIO = 16 or 64, as defined by DR in
CNTLB.
Bit 0 is the Transmit Interrupt Enable
TIE should be set to a 1 to enable ASCI transmit interrupt requests. An interrupt (IRQ3) is generated when TDRE (bit 1 of the STAT register) is a 1. TIE is cleared to 0 at Power-
If BRG mode = 1:
Baud Rate = SCLK (2 x (TC + 2) x Divide Ratio
On Reset. An anomaly exists that requires setting of the RIE bit to allow the generation of transmit interrupts. If RIE is not set, transmit interrupts are not generated, even if TIE is set. See Precautions. or
TC =
SCLK 2 x Baud Rate x Divide Ratio
-2
Baud Rate Generation Summary
The application can select between one of two baud rate generators for the ASCI. If the BRG Mode bit in the ASEXT register is set to a 0, the SS2,1,0 bits, the DR, bit and the PR bit in CNTLB are used to select the baud rate. If the BRG Mode bit is set to a 1, the ASTL and ASTH registers are used to select the baud rate. The following formulas are used to calculate the baud rate from the two baud rate generators: If BRG mode = 0: Where: 1. SCLK is the system clock. 2. TC is the 16-bit value programmed into ASTL and
ASTH.
3. DIVIDE RATIO = 16 or 64, as defined by DR in
CNTLB.
4. Baud Rate is the desired baud rate.
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ASCI STATUS REGISTER (STAT) (Continued)
Table 27. Baud Rate List (BRG Mode = 0) Prescaler Divide Ratio Sampling Rate Baud Rate Divide Ratio /1 /2 /4 /8 /16 /32 /64 /1 /2 /4 /8 /16 /32 /64 /1 /2 /4 /8 /16 /32 /64 /1 /2 /4 /8 /16 /32 /64 General Divide Ratio SCLK / 160 SCLK / 320 SCLK / 640 SCLK / 1280 SCLK / 2560 SCLK / 5120 SCLK / 10240 SCLK / 640 SCLK / 1280 SCLK / 2560 SCLK / 5120 SCLK / 10240 SCLK / 20480 SCLK / 40960 SCLK / 480 SCLK / 960 SCLK / 1920 SCLK / 3840 SCLK / 7680 SCLK / 15360 SCLK / 30720 SCLK / 1920 SCLK / 3840 SCLK / 7680 SCLK / 15360 SCLK / 30720 SCLK / 61440 SCLK / 122880 Example Baud Rate (bps) SCLK = SCLK = SCLK = 6.144 4.608 3.072 MHz MHz MHz 38400 19200 9600 4800 2400 1200 600 9600 4800 2400 1200 600 300 150 4800 2400 1200 600 300 150 75 2400 1200 600 300 150 75 37.5 19200 9600 4800 2400 1200 600 300 4800 2400 1200 600 300 150 75
PS
DR
Rate
SS2 0 0 0 0 1 1 1 0 0 0 0 1 1 1 0 0 0 0 1 1 1 0 0 0 0 1 1 1
SS1 0 0 1 1 0 0 1 0 0 1 1 0 0 1 0 0 1 1 0 0 1 0 0 1 1 0 0 1
SS0 0 1 0 1 0 1 0 0 1 0 1 0 1 0 0 1 0 1 0 1 0 0 1 0 1 0 1 0
0
16
0
SCLK / 10
1
64
0
16
1
SCLK / 30
1
64
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LOW VOLTAGE PROTECTION
VCC (Volts)
3.80
3.60
3.40
VLV (Typical)
A RUN/HALT Mode B STOP Mode
3.20
B
3.00
A
2.80
2.60
2.40 -60 -40 -20 0 20 40 60 80 100 120 140 Temperature (C)
Figure 36. Typical Low Voltage Protection vs. Temperature
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MASK OPTIONS
Below is an example of the ROM mask bit option selection for this product.
Options ROM Protect RAM Protect System Clock Source Oscillator Operational Mode WDT Mode Auto Latch Mode Port 0 Pull-Ups Port 1 Pull-Ups Port 2 Pull-Ups Option Selections Disable ROM Protect Disable RAM Protect RC Oscillator Enable Normal High-Frequency Operation Enabled WDT Enabled by Software Only Disable Auto Latches Disable Pull-Ups Disable Pull-Ups Disable Pull-Ups Enable ROM Protect Enable RAM Protect Crystal/Other Clock Source 32-kHz Crystal Operation Enabled (Limits High-Frequency Operation) WDT Enabled Automatically After RESET Enable Auto Latches Enable Pull-Ups Enable Pull-Ups Enable Pull-Ups
ROM Protect. Selecting the DISABLE ROM PROTECT option READs the software program that is in the program memory using ZiLOG's internal factory test mode. However, none of the standard methods for reading or verifying the code in the microcontroller uses an EPROM programmer. With this option disabled, ZiLOG is able to fully test the ROM memory and provides its standard warranty for the part. Selecting the ENABLE ROM PROTECT option negates the possibility of reading the code out of the part using a tester, programmer, or any other standard method. ZiLOG will be unable to test the ROM memory at any time prior to customer delivery.
allows protection (under software control) of a portion of the RAM's address space from being read or written.
System Clock Source. Selecting the RC OSCILLATOR ENABLE option, configures the oscillator circuit on the mi-
crocontroller to work with an external RC circuit. Selecting the CRYSTAL/OTHER CLOCK SOURCE option configures the oscillator circuit to work with an external crystal, ceramic resonator, or LC oscillator.
Oscillator Operational Mode. Selecting the NORMAL HIGH FREQUENCY OPERATION ENABLED option en-
The ROM PROTECT option bit only affects the ability to read the code and does not affect the operation of the part in an application. If the ROM PROTECT option is disabled, ZiLOG tests the part for ROM fallout and parts which fail are not shipped to the customer. When the ROM PROTECT option is enabled, ZiLOG cannot perform these tests on the ROM. When ROM PROTECT is enabled, except for the improper transfer of the code by ZiLOG, all ROM memory software errors shall be the responsibility of the Buyer and ZiLOG shall have no obligation to repair or replace product containing software errors. Selecting the ENABLE ROM PROTECT option waives all warranties of ZiLOG, expressed or implied, on microcontrollers containing ROM failures including, but not limited to, the implied warranty of merchantability and fitness for a particular purpose.
RAM Protect. Selecting the DISABLE RAM PROTECT option does not affect the RAM memory. RAM memory operates as defined in this Product Specification for all address locations. Selecting the ENABLE RAM PROTECT option, 58
ables the part to operate using a standard crystal or resonator, but it does not operate using a 32-kHz crystal. Selecting the 32-KHZ OPERATION ENABLED option enables the microcontroller to work with a 32-kHz crystal and an external feedback resistor--these must be supplied between the XTAL1 and XTAL2 pins. (If RC OSCILLATOR ENABLED is selected in the SYSTEM CLOCK SOURCE option, this option defaults to the NORMAL HIGH FREQUENCY OPERATION ENABLED bit.)
WDT Mode. Selecting the WDT ENABLED BY SOFTWARE ONLY option operates the Watch Dog Timer (WDT) when turned on under software control. Selecting the WDT ENABLED AUTOMATICALLY AFTER RESET option starts the WDT automatically at RESET.There is no way to dis-
able or stop this mode, making it necessary in the code to periodically clear the WDT to prevent it from resetting the microcontroller. If the WDT ENABLED AUTOMATICALLY AFTER RESET option and the WDT DRIVEN BY SYSTEM CLOCK option (if offered) are selected, the WDT nev-
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er operates in STOP mode, and cannot be enabled, by any means, to operate in STOP mode.
Auto Latch Mode. Selecting the DISABLE AUTOLATCHES option disables the autolatches on the Port pins. These
Port 0 pins. This option bit does not affect any of the other port pins on the part.
Port 1 Pull-Ups. Selecting DISABLE PULL-UPS disables the input pull-up circuitry on all Port 1 pins. Selecting ENABLE PULL-UPS enables the input pull-up circuitry on all Port 1 pins. This option bit does not affect any of the other port pins on the part. Port 2 Pull-Ups. Selecting DISABLE PULL-UPS disables the input pull-up circuitry on all Port 2 pins. Selecting ENABLE PULL-UPS enables the input pull-up circuitry on all Port 2 pins. This option bit does not affect any of the other port pins on the part.
pins will float rather than be pulled to a valid CMOS level when they are inputs and not connected to an external signal. Selecting the ENABLE AUTOLATCHES option enables the autolatches on the Port pins and pulls the pins to a valid CMOS level when they are not connected to an external signal.
Port 0 Pull-Ups. Selecting DISABLE PULL-UPS disables the input pull-up circuitry on all Port 0 pins. Selecting ENABLE PULL-UPS enables the input pull-up circuitry on all
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EXPANDED REGISTER FILE CONTROL REGISTERS
SMR (FH) 0B D7 D6 D5 D4 D3 D2 D1 D0 SCLK/TCLK Divide-by-16 0 OFF * * 1 ON External Clock Divide by 2 0 SCLK/TCLK =XTAL/2* 1 SCLK/TCLK =XTAL STOP-Mode Recovery Source 000 POR Only and/or External Reset* 001 P30 010 P31 011 P32 100 P33 101 P27 110 P2 NOR 0-3 111 P2 NOR 0-7 Stop Delay 0 OFF 1 ON* Stop Recovery Level 0 Low* 1 High Stop Flag (Read only) 0 POR* 1 Stop Recovery Note: Not used in conjunction with SMR2 Source * Default setting after RESET. * * Default setting after RESET and STOP-Mode Recovery.
WDTMR (F) 0F D7 D6 D5 D4 D3 D2 D1 D0
WDT TAP 00 01 * 10 11
INT RC OSC System Clock 3.5 ms 128 SCLK 10 ms 256 SCLK 14 ms 512 SCLK 56 ms 2048 SCLK
WDT During HALT 0 OFF 1 ON * WDT During STOP 0 OFF 1 ON * XTAL1/INT RC Select for WDT 0 On-Board RC * 1 XTAL Reserved (Must be 0)
* Default setting after RESET
Figure 39. Watch-Dog Timer Mode Register (WRITE ONLY)
Figure 37. Stop-Mode Recovery Register (WRITE ONLY, except Bit D7, which is READ ONLY)
SMR2 (0F) DH D7 D6 D5 D4 D3 D2 D1 D0
Stop-Mode Recovery Source 2 00 POR only* 01 AND P20,P21,P22,P23 10 AND P20,P21,P22,P23,P24, P25,P26,P27 Reserved (Must be 0)
Note: Not used in conjunction with SMR Source
Figure 38. Stop-Mode Recovery Register2
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Z8 CONTROL REGISTERS
PCON (FH) 00H D7 D6 D5 D4 D3 D2 D1 D0 Comparator Output Port 3 0 P34, P37 Standard Output* 1 P34, P37 Comparator Output 0 Port 1 Open Drain 1 Port 1 Push-pull Active* 0 Port 0 Open Drain 1 Port 0 Push-pull Active* 0 Port 0 Low EMI 1 Port 0 Standard* 0 Port 1 Low EMI 1 Port 1 Standard* 0 Port 2 Low EMI 1 Port 2 Standard* 0 Port 3 Low EMI 1 Port 3 Standard* Low EMI Oscillator 0 Low EMI 1 Standard*
R242 T1 D7 D6 D5 D4 D3 D2 D1 D0
T1 Initial Value (When Written) (Range: 1-256 Decimal 01-00 HEX) T1 Current Value (When Read)
Figure 42. Counter/Timer 1 Register (F2H: READ/WRITE)
R243 PRE1 D7 D6 D5 D4 D3 D2 D1 D0
*Default Setting After Reset Must be set to one for devices in 28-pin packages
Count Mode 0 T1 Single Pass 1 T1 Modulo N Clock Source 1 T1Internal 0 T1External Timing Input (TIN) Mode Prescaler Modulo (Range: 1-64 Decimal 01-00 HEX)
Figure 40. Port Configuration Register (PCON) (WRITE ONLY)
R241 TMR D7 D6 D5 D4 D3 D2 D1 D0
Figure 43. Prescaler 1 Register (F3H: WRITE ONLY)
0 No Function 1 Load T0 0 Disable T0 Count 1 Enable T0 Count 0 No Function 1 Load T1 0 Disable T1 Count 1 Enable T1 Count TIN Modes 00 External Clock Input 01 Gate Input 10 Trigger Input (Non-retriggerable) 11 Trigger Input (Retriggerable) TOUT Modes 00 Not Used 01 T0 Out 10 T1 Out 11 Internal Clock Out
R244 T0 D7 D6 D5 D4 D3 D2 D1 D0
T0 Initial Value (When Written) (Range: 1-256 Decimal 01-00 HEX) T0 Current Value (When Read)
Figure 44. Counter/Timer 0 Register (F4H: READ/WRITE)
Figure 41. Timer Mode Register (F1H: READ/WRITE)
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Z8 CONTROL REGISTERS (Continued)
R245 PRE0 D7 D6 D5 D4 D3 D2 D1 D0
R248 P01M D7 D6 D5 D4 D3 D2 D1 D0
Count Mode 0 T0 Single Pass 1 T0 Modulo N Reserved (Must be 0) Prescaler Modulo (Range: 1-64 Decimal 01-00 HEX)
P00-P03 Mode 00 Output 01 Input 1X A11-A8 Stack Selection 0 External 1 Internal P10 - P17 Mode 00 Byte Output 01 Byte Input 10 AD7 - AD0 11 High-Impedance AD7-AD0, AS, DS, R/W, A11-A8, A15-A12, If Selected External Memory Timing 0 Normal 1 Extended
Figure 45. Prescaler 0 Register (F5H: WRITE ONLY)
R246 P2M
D7 D6 D5 D4 D3 D2 D1 D0
For 28 pin device, the user must set: D2=1 D3=0 D4=0
P04-P07 Mode 00 Output 01 Input 1X A15-A12
P20 - P27 I/O Definition 0 Defines Bit as Output 1 Defines Bit as Input
Figure 46. Port 2 Mode Register (F6H: WRITE ONLY)
R249 IPR
Figure 48. Port 0 and 1 Mode Register (F8H: WRITE ONLY)
D7 D6 D5 D4 D3 D2 D1 D0
R247 P3M D7 D6 D5 D4 D3 D2 D1 D0 0 Port 2 Pull-Ups Open Drain 1 Port 2 Push-Pull Active 0 P31, P32 Digital Mode 1 P31, P32 Analog Mode 0 P32 = Input P35 = Output 1 P32 = DAV0/RDY0 P35 = RDY0/DAV0 00 P33 = Input P34 = Output 01 P33 = Input 10 P34 = DM 11 P33 = DAV0/RDY0 P34 = RDY1/DAV1 0 P31 P36 1 P31 P36 0 P30 P37 = = = = = = Input (TIN) Output (T ) OUT DAV2/RDY2 RDY2/DAV2 Input Output
Interrupt Group Priority 000 Reserved 001 C > A > B 010 A > B > C 011 A > C > B 100 B > C > A 101 C > B > A 110 B > A > C 111 Reserved IRQ1, IRQ4 Priority (Group C) 0 IRQ1 > IRQ4 1 IRQ4 > IRQ1 IRQ0, IRQ2 Priority (Group B) 0 IRQ2 > IRQ0 1 IRQ0 > IRQ2 IRQ3, IRQ5 Priority (Group A) 0 IRQ5 > IRQ3 1 IRQ3 > IRQ5 Reserved (Must be 0)
Reserved (must be 0)
Figure 49. Interrupt Priority Register (F9H: WRITE ONLY)
Figure 47. Port 3 Mode Register (F7H: WRITE ONLY)
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R250 IRQ D7 D6 D5 D4 D3 D2 D1 D0
R253 RP D7 D6 D5 D4 D3 D2 D1 D0
IRQ0 = P32 Input IRQ1 = P33 Input IRQ2 = P31 Input IRQ3 = P30 Input IRQ4 = T0 IRQ5 = T1 Inter Edge P31 P32 = 00 P31 P32 = 01 P31 P32 = 10 P31 P32 = 11
Expanded Register File Working Register Pointer
Figure 53. Register Pointer (FDH: READ/WRITE)
Figure 50. Interrupt Request Register (FAH: READ/WRITE)
R254 SPH D7 D6 D5 D4 D3 D2 D1 D0
R251 IMR D7 D6 D5 D4 D3 D2 D1 D0
Stack Pointer Upper Byte (SP8 - SP15)
Figure 54. Stack Pointer High (FEH: READ/WRITE)
1 Enables IRQ0-IRQ5 (D0 = IRQ0) 1 Enables RAM Protect * 1 Enables Interrupts
R255 SPL D7 D6 D5 D4 D3 D2 D1 D0
* This option must be selected when ROM code is submitted for ROM Masking, otherwise this control bit is disabled permanently.
Figure 51. Interrupt Mask Register (FBH: READ/WRITE)
Stack Pointer Lower Byte (SP0 - SP7)
Figure 55. Stack Pointer Low (FFH: READ/WRITE)
R252 FLAGS D7 D6 D5 D4 D3 D2 D1 D0
User Flag F1 * User Flag F2 * Half Carry Flag Decimal Adjust Flag Overflow Flag Sign Flag Zero Flag Carry Flag * Not affected by reset
Figure 52. Flag Register (FCH: READ/WRITE)
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PACKAGE INFORMATION
Figure 56. 28-Pin DIP Package Diagram
Figure 57. 28-Pin SOIC Package Diagram
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Figure 58. 28-Pin PLCC Package Diagram
Figure 59. 40-Pin DIP Package Diagram
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Figure 60. 44-Pin PLCC Package Diagram
Figure 61. 44-Pin QFP Package Diagram
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ORDERING INFORMATION
Z86C34 Standard Temperature 28-Pin DIP 28-Pin SOIC Z86C3416PSC Z86C3416SSC 28-Pin PLCC Z86C3416VSC Extended Temperature 28-Pin DIP 28-Pin SOIC Z86C3416PEC Z86C3416SEC 28-Pin PLCC Z86C3416VEC
Z86C35 Standard Temperature 28-Pin DIP 28-Pin SOIC Z86C3516PSC Z86C3516SSC 28-Pin PLCC Z86C3516VSC Extended Temperature 28-Pin DIP 28-Pin SOIC Z86C3516PEC Z86C3516SEC 28-Pin PLCC Z86C3516VEC
Z86C36 Standard Temperature 28-Pin DIP 28-Pin SOIC Z86C3616PSC Z86C3616SSC 28-Pin PLCC Z86C3616VSC Extended Temperature 28-Pin DIP 28-Pin SOIC Z86C3616PEC Z86C3616SEC 28-Pin PLCC Z86C3616VEC
Z86C44 Standard Temperature 40-Pin DIP 44-Pin PLCC Z86C4416PSC Z86C4416VSC 44-Pin QFP Z86C4416FSC Extended Temperature 40-Pin DIP 44-Pin PLCC Z86C4416PEC Z86C4416VEC 44-Pin QFP Z86C4416FEC
Z86C45 Standard Temperature 40-Pin DIP 44-Pin PLCC Z86C4516PSC Z86C4516VSC 44-Pin QFP Z86C4516FSC Extended Temperature 40-Pin DIP 44-Pin PLCC Z86C4516PEC Z86C4516VEC 44-Pin QFP Z86C4516FEC
Z86C46 Standard Temperature 40-Pin DIP 44-Pin PLCC Z86C4616PSC Z86C4616VSC 44-Pin QFP Z86C4616FSC Extended Temperature 40-Pin DIP 44-Pin PLCC Z86C4616PEC Z86C4616VEC 44-Pin QFP Z86C4616FEC
For fast results, contact your local ZiLOG sales office for assistance in ordering the part required.
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PRECAUTIONS (Continued) PRECAUTIONS
1. Enabling the transmit interrupt (bit 0 in the ASCI STAT register) does not make the device ready for transmitter-related interrupts. The receiver interrupt (bit 3 in the ASCI STAT register) must also be enabled. Workaround: For transmit interrupts to be generated, the RIE bit must also be set. When IRQ3 is generated, the software should check the STAT register for details on the interrupt source. 2. When using the device in full-duplex mode under interrupts (both transmit and receive interrupts enabled), a small window exists where a transmit or receive interrupt may be lost. This situation occurs when an interrupt is generated by one side (either the transmitter or receiver) and, before the interrupt is serviced, another interrupt is generated by the other side. The second interrupt may be lost. Workaround: The only workaround is not to use transmitter interrupts when using the ASCI in fullduplex mode. Use the transmitter in polled mode and the receiver in interrupt mode for full duplex operation. In half-duplex operation, this anomaly does not create a problem.
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CODES
For fast results, contact your local ZiLOG sales office for assistance in ordering the part required.
Preferred Package Longer Lead Time P = Plastic DIP V = Plastic Chip Carrier F = Plastic Quad Flat Pack S = Small Outline Integrated Chip S = 0C to +70C E = -40C to +105C 16 = 16 MHz C = Plastic Standard
Preferred Temperature Longer Lead Time Speed Environmental
Example:
The Z86C36 is a 16-MHz PLCC, 0C to 70C, with Plastic Standard Flow.
Z 86C36 16 P S C ZiLOG Prefix Product Number Speed Package Temperature Environmental Flow
Pre-Characterization Product The product represented by this document is newly introduced and ZiLOG has not completed the full characterization of the product. The document states what ZiLOG knows about this product at this time, but additional features or nonconformance
with some aspects of the document may be found, either by ZiLOG or its customers in the course of further application and characterization work. In addition, ZiLOG cautions that delivery may be uncertain at times, due to start-up yield issues.
(c)1999 by ZiLOG, Inc. All rights reserved. Information in this publication concerning the devices, applications, or technology described is intended to suggest possible uses and may be superseded. ZiLOG, INC. DOES NOT ASSUME LIABILITY FOR OR PROVIDE A REPRESENTATION OF ACCURACY OF THE INFORMATION, DEVICES, OR TECHNOLOGY DESCRIBED IN THIS DOCUMENT. ZiLOG ALSO DOES NOT ASSUME LIABILITY FOR INTELLECTUAL PROPERTY INFRINGEMENT RELATED IN ANY MANNER TO USE OF INFORMATION, DEVICES, OR TECHNOLOGY DESCRIBED HEREIN OR OTHERWISE.
Except with the express written approval of ZiLOG, use of information, devices, or technology as critical components of life support systems is not authorized. No licenses are conveyed, implicitly or otherwise, by this document under any intellectual property rights. ZiLOG, Inc. 910 East Hamilton Avenue, Suite 110 Campbell, CA 95008 Telephone (408) 558-8500 FAX (408) 558-8300 Internet: http://www.zilog.com 69
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